ECU Board Layout for Heat Dissipation With Non-Ground Heat Sinks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic control devices face challenges in improving heat dissipation without reducing the mounting area, especially when the heat sink has a non-ground potential and is not directly connected to the housing.
Innovation Solution
The electronic control device incorporates a board with a heat sink mounted on it, where the housing is in contact with the board to dissipate heat. The board includes a first layer with non-ground wiring in direct contact with the heat sink and a second layer with ground wiring in electrical and thermal contact with the housing, allowing the non-ground wiring and ground wiring to overlap in plan view.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wiring structure is provided to electrically insulate the heat sink from GND wiring when the heat sink is not dropped to GND, then electrical insulation is achieved, but heat dissipation property deteriorates
Solution Approach 1:
The patent introduces an intermediary ground wiring layer between the non-ground heat sink and the GND wiring. This intermediate ground wiring serves as a thermal bridge to conduct heat away from the heat sink, while the electrical insulation structure (insulating film or insulating housing) prevents electrical short circuits. The intermediary element resolves the conflict by providing separate thermal and electrical pathways.
2Area of stationary object
If the mounting area is reduced to improve device compactness, then device size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent utilizes the vertical dimension (thickness direction) to resolve the area-heat dissipation contradiction. By stacking the ground wiring layer beneath the heat sink in the vertical direction, the patent creates a three-dimensional heat dissipation pathway. This allows heat to be conducted away from the heat sink through the vertical stack, compensating for the reduced planar mounting area and maintaining effective heat dissipation capability in a compact footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation for electronic components with non-ground heat sinks without reducing the mounting area, effectively managing heat transfer between the heat sink and the housing.
Implementation Method 1
a second layer including a second ground wiring that is in electrical and thermal contact with the housing
Implementation Method 2
The first non-ground wiring and the second ground wiring overlap each other in plan view from a thickness direction of the board
Data Source
AI summary
An electronic control device includes a board including a heat sink on which a heat generation element is mounted, and a housing that is in contact with the board and dissipates heat of the heat generation element to the outside. A potential of the housing is a ground, and a potential of the heat sink is a non-ground. The board includes a first layer including a first non-ground wiring that is in direct contact with the heat sink, and a second layer including a second ground wiring that is in electrical and thermal contact with the housing. The first non-ground wiring and the second ground wiring overlap each other in plan view from a thickness direction of the board.