Ceramic Substrate Crack Detection with Closed-Loop Wiring
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Solution Overview
Problem
Current crack detection methods for ceramic substrates are limited to edge detection and lack accuracy in locating cracks within the substrate, leading to missed detections and lower overall detection reliability.
Innovation Solution
A substrate design with a detection assembly comprising detecting units and connecting units formed by detecting wires that create closed loop areas around installation areas, allowing for improved crack localization and detection accuracy by verifying continuity across multiple wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resistance-based crack detection is used at substrate edges, then detection capability is provided, but detection precision and localization accuracy deteriorate
Solution Approach 1:
The substrate edge is divided into multiple detection segments by arranging multiple detecting wires (first detecting wire, second detecting wire, third detecting wire, fourth detecting wire) at different positions. Each wire segment independently monitors a specific region, transforming a single low-precision detection point into multiple high-precision detection segments, thereby enabling both comprehensive coverage and precise crack localization.
Solution Approach 2:
The detection system transitions from one-dimensional edge detection to two-dimensional area coverage by arranging detecting wires in a distributed pattern around the substrate edge. The detecting wires form closed loops that encompass the installation area, creating a spatial detection network that provides both perimeter monitoring and internal crack localization capability.
2Device complexity
If few detecting endpoints are used in resistance-based method, then device complexity is reduced, but detection accuracy deteriorates
Solution Approach 1:
Each detecting wire serves multiple functions: it acts as a resistance monitoring element for crack detection, forms part of closed loops for area coverage, and provides spatial reference for crack localization. The detecting wires simultaneously perform perimeter monitoring and internal defect detection, eliminating the need for separate detection systems and maintaining low device complexity while achieving high detection accuracy.
3Measurement precision
If detecting wires form closed loop areas around installation areas, then crack localization accuracy is improved, but device complexity increases
Solution Approach 1:
The detection assembly merges the detecting units and connecting units into an integrated closed-loop wire structure. The detecting wires are continuously formed loops that combine multiple detection functions into a single structural element, eliminating the need for separate detecting units and connecting components. This merging reduces the number of parts and assembly steps while maintaining high crack localization accuracy through the closed-loop geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise crack detection and localization within ceramic substrates by ensuring comprehensive coverage and reducing missed detections, enhancing detection reliability and accuracy.
Implementation Method 1
crack detection in ordinary substrates is mostly done by detecting the resistance of wiring. This method involves setting a circle of crack detecting wires at edges of the ordinary substrate and then detecting the resistance of these lines to determine the presence of cracks.
Data Source
AI summary
A substrate with a crack detection function, comprising an installation area for installing hardware, a wiring area, and a detection assembly. The wiring area is set around the installation area. The detection assembly is in the wiring area. The detection assembly includes a plurality of detecting units and a plurality of connecting units. The plurality of detecting units is set around the wiring area. Two ends of each connecting unit are respectively connected to two detecting units, forming a circuit for detecting whether cracks exist in the substrate. Each detecting unit includes at least two detecting endpoints. Each connecting unit includes at least two detecting wires, with each end of one detecting wire connected to one detecting endpoint of two detecting units. The at least two detecting wires between two non-adjacent detecting units are set around outside of the installation area to form a closed loop area.