Ceramic Substrate Dividing Grooves for Stable Semiconductor Division
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Solution Overview
Problem
Conventional semiconductor device manufacturing processes require expensive equipment for forming dividing grooves on sealing resin, leading to increased costs and variability in crack direction during division, which can expose surface mount components.
Innovation Solution
The process involves forming dividing grooves on both front and rear surfaces of a ceramic substrate before sealing, with specific relationships between groove depths and substrate thickness to ensure high positional accuracy and stability during division, using epoxy resin with a minimum elasticity modulus of 0.5 GPa and Vickers hardness of 2.3 for reduced crack variation and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dividing grooves are formed on sealing resin using a dicing machine or laser cutting machine, then division can be stably performed while preventing exposure of surface mount components, but an expensive apparatus is additionally required increasing manufacturing cost
Solution Approach 1:
Dividing grooves are formed on the ceramic substrate before mounting surface mount components and applying sealing resin. This preliminary formation of dividing grooves eliminates the need for subsequent expensive dicing machines or laser cutting machines, while ensuring stable division that prevents exposure of electric wires and electrodes.
Solution Approach 2:
The function of forming dividing grooves is extracted from the sealing resin processing stage and transferred to the ceramic substrate preparation stage. This separation allows the use of simpler, less expensive equipment for groove formation while maintaining division stability through proper groove design on the substrate.
2Ease of manufacture
If V-shaped dividing grooves are formed on both sides of base substrate with depth about 1/3 of substrate thickness, then semiconductor device can be easily manufactured at low cost, but cracks generated at division time have varying extending directions and surface mount components are exposed
Solution Approach 1:
The depth of dividing grooves on the ceramic substrate is optimized to a specific range (0.5-2.0 mm) based on substrate thickness, and the groove shape is designed with specific dimensional relationships. These parameter optimizations ensure that cracks propagate in controlled directions during division while maintaining cost-effectiveness through simple groove formation processes.
3Device complexity
If dividing grooves are formed only on rear surface of ceramic substrate, then manufacturing process is simplified, but positional accuracy during division is reduced
Solution Approach 1:
Dividing grooves are formed on both the front and rear surfaces of the ceramic substrate before component mounting and sealing. This dual-sided groove formation provides reference features on both surfaces, enabling high positional accuracy during division while maintaining a relatively simple manufacturing process.
Data Source
AI summary
In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces on both front and rear surfaces in advance, a plurality of the surface mount components are mounted on the multiple piece substrate and sealed collectively by the sealing resin, and the substrate is divided along the dividing grooves. Further, when the shortest distance from an end on the front surface of the ceramic substrate to an end of the surface mount component is set to “a”μm, a thickness of the ceramic substrate is set to “b”μm, and sum of depths of the dividing grooves on the front and rear surfaces of the ceramic substrate is set to “c”μm, a relationship of a≧269×c/b+151 is established.