Ceramic Substrate Metal Layers Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor packaging techniques face limitations in heat dissipation due to the insulative properties of ceramic packages and growth substrates, which restrict the transfer of heat away from semiconductor dies, leading to potential device degradation and altered optical properties in LEDs.
Innovation Solution
A ceramic substrate with exposed metal layers deposited adjacent to its lower surface is used to enhance thermal conductivity, allowing for increased heat dissipation and simplifying the manufacturing process by enabling higher firing temperatures and larger metal structures for improved heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional ceramic packages with insulative properties are used, then manufacturing simplicity is maintained, but heat dissipation capability deteriorates
Solution Approach 1:
The patent employs a composite package structure combining ceramic substrate with metal layers (copper, aluminum, or alloys) to achieve both thermal conductivity and manufacturing feasibility. The metal layers are integrated into the ceramic package through cofiring or sintering processes, creating a hybrid material system that leverages the electrical insulation of ceramic and thermal conductivity of metal.
Solution Approach 2:
The invention applies thermal management selectively by placing high-conductivity metal layers specifically at the bottom of the ceramic package where heat dissipation is most critical, rather than making the entire package thermally conductive. This localized approach optimizes heat transfer from the semiconductor die while maintaining the overall structural integrity and manufacturing simplicity of the ceramic package.
2Temperature
If metal layers are deposited adjacent to the lower surface of the ceramic substrate, then thermal conductivity is improved, but manufacturing complexity increases
Solution Approach 1:
The metal layers are prepared and positioned before the final ceramic package assembly and firing process. Green tape layers with pre-formed metal patterns are stacked and aligned, then cofired in a single step that simultaneously bonds the ceramic and sinters the metal, eliminating separate metal deposition steps after package assembly.
Solution Approach 2:
The patent combines multiple manufacturing operations into a single cofiring or sintering step that simultaneously: (1) bonds the ceramic substrate layers, (2) sinteres the metal layers to achieve desired thermal conductivity, and (3) integrates the metal layers with the ceramic structure. This merging of processes reduces manufacturing complexity despite the advanced functionality achieved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases thermal conductivity, allowing for more effective heat dissipation from semiconductor dies compared to conventional packages, reducing thermal resistance and preventing device degradation while maintaining simpler fabrication processes.
Implementation Method 1
one or more metal layers deposited adjacent to the lower surface for dissipating heat away from the semiconductor die
Data Source
AI summary
A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation.