Semiconductor/Solid-State Device Details TRIZ Cases

Notched resin insulating layers on heat dissipation plates enable strong adhesive bonding, solving reliability issues in high-temperature environments.

Re-oxidizing buried insulator side faces to form silicon dioxide layers.

A semiconductor device with a curved side surface prevents metal layer peeling and cracking during dicing, improving die-bonding strength.

Variable wiring widths in the tape carrier overlap section maintain mechanical strength while preventing adjacent bump electrode contact.

A vertical memory device channel includes a lower protrusion connecting to the substrate to enhance mechanical stability.

Interleaving power and ground pads between signal rows shortens redistribution paths to minimize noise interference.

A semiconductor pad covers the via to isolate the MIM capacitor lower electrode from substrate expansion.

Vertical bit line contacts reduce resistance and capacitance, resolving shorting risks from small pitch.

Segmented adhesive layers with chamfered corners in OLED devices decrease moisture permeation rates and mitigate stress-induced substrate deformation.

A fan-out chip packaging method integrates bumped and non-bumped dies using a carrier substrate and dielectric layers with through-holes.

Segmenting silicon nitride films prevents ultraviolet-induced cracking while maintaining tensile stress for carrier mobility.

Exposed metal plates bypass insulative plastic casings to lower junction temperatures and maintain optical output.

A terminal with a dielectric depression and routed trace connects an integrated circuit through lateral conductive paths.

An aluminum oxide film isolates alkaline etching agents from the semiconductor layer, preventing damage while maintaining low forward voltage.

A chip package uses a third conducting layer to surround the substrate periphery and connect to EMI ground pads.

A method electroplates thick metal pads on a substrate using an isolated ground plane to establish electrical contact during deposition.

A wiring board uses a surface groove to restrict bonding material flow toward the component mounting area.

Wet chemical cleaning forms recesses on contact pads, enabling low resistance conductive bumps while eliminating complex bake processes.

A substrate groove dissipates heat and stress to maintain airtightness.

A semiconductor plug structure uses a hard mask layer to prevent over-etching during via formation.

A die stack uses a conductive pillar inserted into a recessed socket within an annular via to create a stable interlocking feature.

A photoelectric conversion device integrates a magnetic layer and an infrared ray absorbing layer to shield electromagnetic noise.

Curved terminals nested within the package body enhance solder joint reliability and support high-density I/O operations without increasing planar footprint.

A dam-like metal pad prevents solder paste flooding and corrosion while reducing mechanical stress on the substrate.

A semiconductor device uses a contact trench to form direct electrical connections between metal layers and doped regions.

A millimeter wave package merges a printed wiring board with a waveguide interface to enable high-frequency signal transmission.

Vias extending into lower metal line openings create a non-planar interface that prevents layer separation and catastrophic failure.

Segmented bit lines reduce capacitance and power dissipation while minimizing write-disturb effects in high-density 3D memory.

Through-holes in the base block allow radiation fins to contact heat pipes directly, resolving thickness constraints while minimizing material consumption.

Attaching a dual-layer thermal sheet to the wafer back surface provides heat dissipation paths without increasing packaging complexity.

Siloxane-modified epoxy and acrylate resins modulate thermal expansion to solve mismatch issues in 3D TSV packages.

A frame-like reinforcement layer with a higher modulus of elasticity protects electronic component connection faces from mechanical stress.

Thin silicon substrate and dual-damascene processing reduce thickness while increasing flexibility for complex 3D routing.

A semiconductor package uses a controlled brazing layer to join a high-conductivity metal block within a base structure.

Rounded driving terminals and an anisotropic conductive film distribute mechanical stress, maintaining electrical connection stability during bending.

Conductive plate bonded to insulating base eliminates wire constraints, allowing high current capacity for motor control applications.

Segmenting the weld member into a thin section absorbs friction heat and pressing load, preventing heat deformation while maintaining structural integrity.

A leadframe with side solderable leads uses a mold groove to expose the lead protrusion for enhanced connectivity.

A two-layer copper silicide barrier retains copper atoms through catalytic decomposition, preventing diffusion into dielectric layers.

Sulfurizing metal wiring creates surface crystals to prevent electron scattering, maintaining low electrical resistance during device miniaturization.

A coiled RFID tag encased in a protective shell enables secure attachment to non-flat surfaces without adhesives.

Segmenting the via into sections with different taper angles alleviates edge stress while minimizing occupied area for high-density mounting.

Dielectric wafer bonding eliminates selective alignment costs by enabling post-bond vias that reduce thermal impedance in flip-chip LEDs.

A semiconductor chip package integrates peripheral contact areas within an encapsulation layer to enable flexible board attachment options.

A clad lead frame with a surrounding groove resolves the contradiction between downsizing and adhesion strength.

Composite lamina thermal conductor traces steer heat flux through anisotropic patterns to manage thermal energy distribution.

A planar support structure anchors terminals within a cavity to reduce wire span and simplify wirebonding layouts.

A buck converter package uses stacked dice on a conductive die attach pad to minimize parasitic capacitances and inductances.

A wirebond traverses a substrate block to electrically couple an integrated circuit with a side-mounted optoelectronic component.

A cooling assembly with alternating metal fiber arrays creates a multiple-porosity structure that enhances heat transfer efficiency.