Ceramic Wiring Substrate Electroplating via Exposed Conductor
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Solution Overview
Problem
Existing wiring substrates face issues with unintentional short circuits and increased size due to scratches from electrode pins during electroplating, especially when covering non-conducting surface conductor portions on ceramic substrates with small metalized layers and non-conducting pads.
Innovation Solution
The solution involves forming an opening portion in the ceramic substrate body to expose an electroplating conductor layer, allowing it to be electrically connected to the surface conductor portion, enabling reliable metal plating coverage without exposing the conductor layer at the side surfaces, thus preventing scratches and reducing substrate size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrode pin is brought into point-contact or line-contact with surfaces of metallized layers and pad for electroplating, then metal plating films can be applied, but surfaces are scratched when contact portions are unintentionally shifted
Solution Approach 1:
An electroplating conductor layer is introduced as an intermediary between the electrode pin and the surface conductor portion. This conductor layer is exposed at a specific location on the substrate body, allowing the electrode pin to contact it during electroplating. The electroplating conductor layer acts as a sacrificial mediator that receives the contact force, preventing direct contact between the pin and the surface conductor portion, thereby avoiding scratches while enabling reliable metal plating film application.
2Reliability
If electrode pin is dislodged during electroplating of small metalized layers and non-conducting pad, then electroplating cannot be performed, but increasing substrate size to prevent dislodgement increases overall size
Solution Approach 1:
The electroplating conductor layer serves as a dedicated intermediary contact point that is specifically designed to receive the electrode pin. By exposing this conductor layer at a controlled location rather than relying on contact with small surface conductor portions, the system ensures reliable electroplating performance even when the substrate size is minimized. The intermediary provides a stable, intentional contact target that prevents dislodgement issues.
3Reliability
If separate electrode conductor portion protrudes from substrate body to contact electrode pin, then electroplating can be performed, but substrate body size is increased
Solution Approach 1:
The electroplating conductor layer is merged with the internal wiring structure of the substrate body rather than being a separate protruding component. It is formed within the substrate and exposed at an appropriate location, combining the functions of internal wiring and external contact point. This integration eliminates the need for separate protruding electrode conductor portions, maintaining reliable electrode pin contact while minimizing the overall substrate body size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures reliable coverage of surface conductor portions with metal plating films, reduces the risk of unintentional short circuits, and minimizes substrate size by maintaining electrical connectivity through the exposed electroplating conductor layer.
Implementation Method 1
a surface of the surface conductor portion is covered with a metal plating film; and an electroplating conductor layer that is formed in the substrate body
Data Source
AI summary
A Wiring substrate includes a substrate body that is formed from ceramics, and that includes a front surface, a back surface, and side surfaces positioned between peripheral sides of the front surface and the back surface; a frame-shaped metalized layer (surface conductor portion) that is formed on the front surface of the substrate body, a surface of the frame-shaped metalized layer being covered with a metal plating film; and an electroplating conductor layer that is formed in the substrate body, an end of the electroplating conductor layer being electrically connected to the frame-shaped metalized layer, the other end of the electroplating conductor layer being formed at the front surface of the substrate body, the other end of the electroplating conductor layer being electrically independent of different conductor portions that differ from frame-shaped metalized layer, the electroplating conductor layer being separated from the side surfaces of the substrate body. An opening portion for exposing at least a portion of the electroplating conductor layer at a bottom surface is formed in the front surface of the substrate body.