Galvanic Isolation Medium in Inductor Package

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing semiconductor device packages face challenges in achieving high galvanic isolation while maintaining efficient energy transmission between closely spaced circuit elements, leading to increased fabrication costs, performance issues, and higher failure rates, particularly in miniaturized consumer electronic devices.

Innovation Solution

The use of a galvanic isolation medium, such as borosilicate glass, is implemented between electrical elements, with shielding on either side and a spacer to maintain a spaced arrangement, enhancing galvanic isolation properties and enabling efficient energy transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the distance between primary and secondary coils is increased to improve galvanic isolation, then electrical isolation between coils is improved, but energy transmission efficiency decreases

Engineering Contradiction:
Improvegalvanic isolationVSAvoidenergy transmission efficiency
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

A galvanic isolation medium is introduced as an intermediary substance positioned between the primary and secondary coils. This medium has superior galvanic isolation properties compared to air or conventional packaging materials, enabling effective electrical isolation at reduced distances while maintaining energy transmission efficiency through optimized magnetic coupling.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the physical and electrical parameters of the isolation medium by using materials with specific dielectric constants and magnetic permeability. By selecting materials with appropriate parameters (such as ferrite-based compounds or specialized polymers), the system achieves enhanced galvanic isolation without requiring increased separation distance, thus preserving inductive coupling efficiency.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If conventional packaging materials are used for galvanic isolation, then fabrication is simpler, but galvanic isolation performance is insufficient

Engineering Contradiction:
Improvegalvanic isolation performanceVSAvoidfabrication complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent employs composite materials that combine dielectric and magnetic properties in a single packaging medium. These composite materials provide both structural support and enhanced galvanic isolation, eliminating the need for separate isolation layers and simplifying the overall fabrication process while improving performance.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The packaging medium is designed to serve multiple functions simultaneously: mechanical support, electrical isolation, magnetic shielding, and environmental protection. This multi-functionality reduces the number of separate components needed and simplifies manufacturing while achieving superior galvanic isolation performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If larger surface area packages are used to accommodate isolation structures, then galvanic isolation is improved, but device footprint increases

Engineering Contradiction:
Improvegalvanic isolationVSAvoiddevice footprint
Core Design Contradiction:
ReliabilityVSArea of moving object

Solution Approach 1:

The patent transitions from planar isolation structures to three-dimensional configurations by positioning the galvanic isolation medium vertically between coils or using layered architectures. This dimensional change allows effective isolation within a compact footprint by utilizing the third dimension (height/thickness) rather than requiring increased lateral separation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The galvanic isolation medium is integrated within the existing package structure by nesting it between the coils or embedding it in the substrate. This nesting approach allows the isolation function to be incorporated without adding external volume, maintaining a compact device footprint while achieving effective galvanic isolation.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration provides improved galvanic isolation with a smaller form factor, reducing fabrication costs and failure rates, while maintaining effective energy transmission between closely spaced circuit elements.

Implementation Method 1

galvanic isolation medium arranged between a primary coil and a secondary coil

Methodology Applied
Scientific EffectGalvanic isolation: Electrical Resistance

Implementation Method 2

inductive (electromagnetic) energy transmission between the primary and secondary coils

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 3

the galvanic isolation medium comprises a material like borosilicate glass material

Methodology Applied
Scientific EffectDielectric properties: Dielectric

Implementation Method 4

shielding is arranged on either side of the galvanic isolation medium such that each coil is arranged between the galvanic isolation medium and the associated shielding

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS8674418B2Method and apparatus for achieving galvanic isolation in package having integral isolation medium
Publication Date: 2014.03.18 NAT SEMICON CORP
  • US8674418B2 patent drawing
  • US8674418B2 patent drawing
  • US8674418B2 patent drawing

AI summary

An inductor device having an improved galvanic isolation layer arranged between a pair of coil and methods of its construction are described.