Semiconductor Base Plate Notch Bonding for High-Temp Reliability

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Solution Overview

Problem

Conventional semiconductor devices using direct potting sealing techniques fail to securely bond a case to a metal base plate, especially in high-temperature environments, leading to reduced bonding strength and reliability.

Innovation Solution

A semiconductor device design featuring a heat dissipation metal plate with a resin insulating layer and notches exposed to the metal plate, where the case is bonded using a bonding agent to improve adhesion and secure fixation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If direct potting sealing technique is used without bonding agent, then manufacturing process is simple, but bonding strength between case and metal plate deteriorates in high-temperature environments

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidbonding strength in high-temperature environment

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The bonding agent is applied to the metal plate surface before the case is positioned and sealed, establishing a strong adhesive bond in advance that maintains reliability under high-temperature conditions while preserving the simplicity of the direct potting sealing process

Inventive Principle:

Principle #10Preliminary action

2Reliability

If bonding agent is introduced to improve bonding strength, then reliability in high-temperature environment is improved, but manufacturing process complexity increases

Engineering Contradiction:

Improvebonding strength in high-temperature environmentVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The bonding agent application step is merged with the existing direct potting sealing process flow, where the bonding agent is applied to the metal plate surface before case positioning, and the subsequent sealing resin injection completes both bonding and sealing functions in an integrated manufacturing sequence

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the adhesion between the base plate and the case, ensuring high reliability and thermal efficiency, even in high-temperature conditions, without the need for material changes or additional processes.

Implementation Method 1

The case is bonded to the metal plate by means of a bonding agent

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

a heat dissipation metal plate having a heat dissipation property

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10643922B2Semiconductor device

Publication Date: 2020.05.05 MITSUBISHI ELECTRIC CORP

AI summary

A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.