Concave Terminal IC Package for Solder Joint Reliability
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Solution Overview
Problem
Conventional semiconductor packages face challenges in achieving high density and high I/O count while maintaining low manufacturing costs and improving reliability, especially in the miniaturization of electronic devices.
Innovation Solution
The integration of concave terminals within an encapsulation structure, which provides increased adhesion strength and reliability through an arched or concave shape, facilitating better solder ball attachment and reducing delamination, thereby enhancing the stability and performance of integrated circuit packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional flat terminals are used in semiconductor packages, then manufacturing is simpler, but solder joint reliability and adhesion strength are insufficient
Solution Approach 1:
The patent applies curvature by forming terminals with a concave or arched shape instead of flat surfaces. This curvature increases the surface area and provides better mechanical interlocking with solder balls, thereby improving solder joint reliability and adhesion strength while maintaining manufacturing feasibility through existing molding processes
2Volume of moving object
If package size is reduced for miniaturization, then device portability improves, but I/O density and heat dissipation become more difficult
Solution Approach 1:
The patent utilizes the vertical dimension by forming three-dimensional concave terminals that extend downward into the package body. This allows increased I/O density without increasing the planar footprint, as terminals are arranged in multiple layers and depths, effectively using vertical space to accommodate more connections within a smaller package volume
3Ease of operation
If lead frames are projected from package body, then signal transfer path is provided, but package profile thickness increases
Solution Approach 1:
The patent embeds terminals within the package body rather than projecting them externally. Terminals are nested inside the encapsulation and extend downward into the package, allowing signal transfer functionality to be integrated within the package volume itself, thereby reducing the overall package profile and thickness while maintaining electrical connectivity
Data Source
AI summary
An integrated circuit package system includes: connecting a concave terminal and an integrated circuit; and forming an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal within the encapsulation.