Semiconductor Package Support Structure for RF Integrity
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Solution Overview
Problem
Semiconductor packages face mechanical stress and RF signal degradation due to the use of dielectric underfill materials, which are necessary for robust solder joint attachment but degrade RF performance.
Innovation Solution
A support structure that mechanically supports the package and distributes stress away from solder joints without using underfill or edge bond materials, incorporating a radio frequency (RF) absorber material for improved signal isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If underfill material is used to strengthen solder joint attachment, then mechanical robustness is improved, but RF signal integrity deteriorates
Solution Approach 1:
The patent removes the underfill material entirely from the package structure. Instead of using dielectric underfill that degrades RF signals, the invention uses a support structure made of RF-transparent or RF-absorbing materials that provides mechanical support without interfering with RF signal integrity.
Solution Approach 2:
The patent changes the material parameters by selecting support structure materials with appropriate RF properties (RF-transparent or RF-absorbing) rather than dielectric materials. This parameter change allows mechanical support while maintaining or improving RF signal characteristics.
2Reliability
If edge bond material is used to strengthen package attachment, then mechanical robustness is improved, but RF signal integrity deteriorates
Solution Approach 1:
The patent eliminates edge bond material from the design. The support structure provides mechanical attachment functionality without requiring additional bonding materials that would surround solder joints and degrade RF signals.
3Stability of the object's composition
If dielectric materials are used for mechanical support, then structural stability is improved, but RF signal transmission deteriorates
Solution Approach 1:
The patent changes the material selection from dielectric materials to RF-transparent or RF-absorbing materials for the support structure. This parameter change maintains structural stability while eliminating RF signal degradation caused by dielectric materials.
Solution Approach 2:
The support structure may use composite materials that combine mechanical strength with RF-transparent or RF-absorbing properties, achieving both structural stability and RF signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the mechanical robustness of semiconductor package attachment to PCBs while maintaining RF signal integrity by eliminating the need for dielectric materials, ensuring reliable board-level performance.
Implementation Method 1
The support structure may also include a radio frequency (RF) absorber material that is adjacent to the package in order to improve RF signal isolation within the package.
Data Source
AI summary
Embodiments are provided herein for a packaged semiconductor device and method of fabricating, the device including: a semiconductor die; a redistribution layer (RDL) structure on an active side of the semiconductor die, the RDL structure including a plurality of contact pads on an outer surface of the RDL structure; a plurality of external connections attached to the plurality of contact pads; and a support structure including an attachment portion and two or more standing members extending from an inner surface of the attachment portion, wherein a back side of the package body is attached to the inner surface of the attachment portion.