Integrated Waveguide Package for Millimeter-Wave Thermal Management
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Solution Overview
Problem
Current millimeter wave packaging methods, such as custom aluminum cast chassis and separate printed wire boards, are expensive and inefficient due to serial manufacturing processes, which hinder the production of high-frequency, high-power components like block up converters and solid state power amplifiers.
Innovation Solution
A millimeter wave integrated waveguide interface package device comprising a printed wiring board (PWB) with a monolithic microwave integrated circuit (MMIC) and a waveguide interface, designed for high-frequency and high-power operations, utilizing a heat spreader for thermal management and RF probes for signal transmission, allowing for parallel manufacturing and reduced costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If custom aluminum cast chassis and separate printed wire boards are used, then reliability is improved, but manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent combines the PWB assembly and waveguide interface into a single integrated package structure. The PWB is mounted directly within the waveguide interface housing, eliminating the need for separate custom aluminum cast chassis and separate PWB assembly. This integration allows parallel manufacturing processes while maintaining reliable electrical and mechanical connections, thereby improving productivity without sacrificing reliability.
2Reliability
If custom aluminum cast chassis and separate printed wire boards are used, then reliability is improved, but manufacturing cost increases
Solution Approach 1:
The integration of the PWB assembly and waveguide interface into a single package reduces the number of discrete components and assembly steps. Standardized housing structures replace custom cast aluminum chassis, and the integrated design allows for more efficient manufacturing processes. This reduces material costs, assembly labor, and overall manufacturing complexity while maintaining the reliable connections needed for millimeter wave operation.
3Manufacturing precision
If serial manufacturing process is used, then manufacturing precision is maintained, but productivity decreases
Solution Approach 1:
The integrated package design enables multiple units to be manufactured simultaneously using parallel processing techniques. The standardized housing and mounting structures allow for batch fabrication of PWBs and waveguide interfaces, which can then be assembled together in higher volumes. This integrated approach maintains manufacturing precision through consistent alignment features and standardized connection points while significantly improving overall production throughput.
4Productivity
If integrated waveguide interface is used, then productivity is improved, but device complexity increases
Solution Approach 1:
The integrated package is designed with modular segments that can be manufactured and tested separately before final assembly. The PWB assembly, waveguide interface, and housing are distinct modules with standardized connection interfaces. This segmentation allows for specialized manufacturing processes for each module while the standardized interfaces simplify the integration process, thereby reducing the overall complexity burden despite the integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables low-cost, high-volume production of reliable millimeter wave packages capable of operating at frequencies above 5 GHz and powers up to 0.5 W, with improved thermal management and signal integrity, reducing manufacturing bottlenecks and increasing yield.
Implementation Method 1
a heat spreader attached to one side of the PWB, wherein the MMIC is located in thermal communication with the heat spreader
Implementation Method 2
the RF probe extends out over the waveguide interface opening so as to be configured to launch an RF signal through the waveguide interface opening
Data Source
AI summary
A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W.