IC Packaging Terminal With Dielectric Depression And Routed Trace
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in achieving smaller footprints, higher reliability, and lower costs while addressing issues like EMI radiation, thermal loads, and increased complexity, which complicates manufacturing and reduces product differentiation.
Innovation Solution
The development of an integrated circuit packaging system that includes a terminal with a depression, a dielectric material with gaps, and traces extending over the dielectric material to connect the integrated circuit, enhancing structural rigidity and thermal performance while reducing production costs and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional packaging structures are used, then manufacturing is simpler, but thermal performance and structural rigidity are insufficient
Solution Approach 1:
The packaging structure is segmented into distinct functional layers: a lead frame providing structural support and electrical connections, a dielectric material layer providing insulation and thermal management, and a molded compound layer providing mechanical protection. This segmentation allows each layer to be optimized for its specific function, improving overall thermal performance and rigidity while maintaining manufacturing feasibility through standardized assembly processes.
Solution Approach 2:
The patent employs composite material structures combining dissimilar materials with complementary properties: the lead frame (metal) provides electrical conductivity and structural strength, the dielectric material (ceramic or polymer) provides electrical insulation and thermal pathways, and the molded compound (epoxy or silicone) provides mechanical protection and environmental sealing. This composite approach enables simultaneous optimization of thermal performance, structural rigidity, and electrical functionality.
2Area of stationary object
If packaging footprint is reduced, then device size decreases, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements a nested packaging architecture where the integrated circuit die is mounted within a recess in the lead frame, the dielectric material is applied over the lead frame in a conformal manner, and the molded compound encapsulates the entire assembly. This nesting approach maximizes space utilization, reducing the overall packaging footprint while maintaining adequate clearance and alignment through the hierarchical structure that naturally guides assembly tolerances.
3Reliability
If bond wire length is reduced, then reliability improves, but manufacturing becomes more difficult
Solution Approach 1:
The lead frame is designed with localized pad structures and trace routing that position electrical connection points in optimal locations near the die attachment area. This local optimization of electrical pathway geometry allows bond wires to be shortened and routed more directly, improving reliability by reducing wire length and potential failure points, while the standardized pad layouts maintain ease of manufacture through automated wire bonding processes.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a terminal having a top with a depression; applying a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom; forming a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and connecting an integrated circuit to the terminal through the trace.