3D Conductive Pathway Routing for IC Packaging Density
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Solution Overview
Problem
Integrated circuit packaging systems face challenges in achieving high input/output density, low cost, and improved reliability due to increased miniaturization and functionality integration, with existing solutions failing to effectively address these needs.
Innovation Solution
A method involving a planar support structure with a cavity, a terminal coplanar with the structure, a conductive pathway with a route and interconnect attach portion, and an encapsulation covering the device, which enhances connectivity and reliability by anchoring the terminal and reducing wire span for simplified wirebonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If miniaturization of components is increased to reduce product size, then product size and cost are reduced, but packaging density and interconnection reliability become more difficult to maintain
Solution Approach 1:
The conductive pathway transitions from a traditional two-dimensional planar layout to a three-dimensional structure with route portions that extend vertically and horizontally through the packaging system. This allows interconnections to bypass obstacles and reduce wire span without increasing the footprint of the device, thereby maintaining reliability while minimizing product size.
Solution Approach 2:
The conductive pathway is divided into multiple route portions (first, second, third route portions) that are segmented and routed through different spatial regions. This segmentation allows each portion to be optimized for its specific function and enables the pathway to navigate around obstacles while maintaining overall connectivity and reliability.
2Productivity
If more integrated circuits are packed into the package to increase functionality, then input/output density is improved, but wire crossing and manufacturing complexity increase
Solution Approach 1:
By utilizing three-dimensional routing with vertical and horizontal route portions, the conductive pathway enables higher input/output density without proportionally increasing wire crossing. The multi-dimensional approach allows wires to pass over and under components rather than only alongside them, reducing the complexity of the wirebonding layout.
3Reliability
If terminal anchoring is implemented to improve reliability, then interconnection stability is improved, but manufacturing steps are added
Solution Approach 1:
The terminal anchoring structure is merged with the conductive pathway formation process. The pathway is formed to extend from the terminal into the cavity, and the terminal is anchored to the pathway structure, combining the anchoring function with the interconnection function in a single integrated structure that is formed in one manufacturing sequence.
4Device complexity
If wire span is reduced to simplify wirebonding, then manufacturing complexity is reduced, but interconnect length and routing options are constrained
Solution Approach 1:
The conductive pathway utilizes three-dimensional routing with route portions that extend in multiple directions and planes. This allows the pathway to achieve a reduced effective wire span for wirebonding purposes while accommodating the necessary interconnect length through vertical and diagonal routing segments that are not constrained to a single linear path.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a planar support structure having a cavity; forming a terminal within the cavity with the terminal coplanar with the planar support structure; forming a conductive pathway on the terminal and the planar support structure with the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion; connecting a device and the interconnect attach portion with the interconnect attach portion towards the device; and forming an encapsulation over the planar support structure covering the conductive pathway and the device.