Side-Mounted Optical Engine Wirebonding via Substrate Penetration
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Solution Overview
Problem
The challenge in optical communication systems is efficiently coupling light to or from optoelectronic components in laser-based optical engines due to physical and geometric restrictions, requiring a 90-degree change in the optical signal path which is not effectively managed by standard optical modules.
Innovation Solution
A method involving wirebonding where an integrated circuit on a substrate block is connected to a base substrate, with an optoelectronic component positioned on a side surface oriented to emit or detect light parallel to the substrate plane, using a wirebond that is contacted with the optoelectronic component and then partially removed to maintain electrical coupling while allowing for efficient light directionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the optoelectronic component is positioned on the substrate surface with light emission direction parallel to the substrate, then the geometric constraint for light coupling is improved, but the wirebonding process becomes more complex due to the side-mounted configuration
Solution Approach 1:
The patent transitions from traditional planar wirebonding to three-dimensional wirebonding by extending the wirebond through the substrate thickness. The wirebond is drawn from the first surface, through the substrate block, to the second surface where the optoelectronic component is mounted, enabling electrical connection in the vertical dimension while maintaining parallel light emission geometry.
Solution Approach 2:
The wirebonding process is segmented into distinct operations: drawing the wirebond through the substrate, contacting it with the optoelectronic component on the second surface, and removing the portion between the component and base substrate. This segmentation simplifies the overall process by breaking down the complex side-mounted wirebonding into manageable sequential steps.
2Reliability
If a wirebond is drawn through the substrate to connect the integrated circuit and optoelectronic component, then electrical coupling is achieved, but the wirebond length increases
Solution Approach 1:
The portion of the wirebond that extends from the optoelectronic component to the base substrate is removed after the bonding process. This extraction eliminates unnecessary wirebond length that would otherwise increase inductance and signal delay, while maintaining the essential electrical coupling between the integrated circuit and optoelectronic component through the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the wirebonding process, enables efficient electrical coupling of optoelectronic components to integrated circuits, and allows for light emission or detection in a direction parallel to the substrate plane, addressing the geometric constraints in optical communication systems.
Implementation Method 1
contacting the optoelectronic component comprises heating the wirebond to couple the wirebond to the optoelectronic component
Implementation Method 2
contacting the optoelectronic component comprises performing ultrasonic vibrational welding to couple the wirebond to the optoelectronic component
Data Source
AI summary
The present disclosure is drawn to wirebonding for optical engines having side-mounted optoelectronic components. An integrated circuit is mounted on a first surface of a substrate block, and an optoelectronic component is positioned on a second surface of the substrate block and is oriented to emit light in a direction parallel to a plane defined by the first surface. A wirebond is drawn between the integrated circuit and a base substrate on which the substrate block is mounted. A optoelectronic component is then contacted with the wirebond, and a portion of the wirebond between the optoelectronic component and the base substrate is removed.