Chip Package Vertical Integration Through-Hole
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Solution Overview
Problem
The integration of multiple chips in a single package leads to increased substrate area occupation, higher manufacturing costs, and poor signal transmission speed due to two-dimensional integration, necessitating improved chip disposition and material reliability.
Innovation Solution
A chip package design featuring a semiconductor substrate with a through-hole, a conducting layer on the sidewall, and insulating layers of different materials on the upper and lower surfaces, along with a self-aligned wall to secure the chip position and enhance bonding structure reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If chips are integrated two-dimensionally on a package substrate, then multi-function and high performance requirements are achieved, but the substrate area occupied increases leading to higher manufacturing cost
Solution Approach 1:
The patent transitions from two-dimensional chip arrangement on a substrate to three-dimensional vertical stacking of chips. Multiple chips are stacked in the vertical direction and connected through conductive vias penetrating through each chip layer, thereby achieving multi-function integration without increasing substrate area occupation.
2Adaptability or versatility
If chips are integrated two-dimensionally on a package substrate, then multi-function requirements are achieved, but the package size cannot be reduced effectively
Solution Approach 1:
The invention implements vertical stacking of multiple chips in the thickness direction, connecting them through conductive vias. This three-dimensional integration approach achieves multi-functionality while significantly reducing the lateral dimensions of the package, thereby minimizing overall package size.
3Area of stationary object
If a plurality of chips are integrated in a limited substrate area, then space utilization is improved, but the speed of signal transmission deteriorates
Solution Approach 1:
The patent employs vertical stacking with conductive vias penetrating through chip layers to establish direct vertical interconnections. This eliminates the need for long lateral signal paths on the substrate, thereby maintaining high signal transmission speed while achieving dense space utilization through vertical integration.
4Area of stationary object
If chips are disposed in a limited substrate area, then space efficiency is improved, but reliability of the chip package material needs to be improved
Solution Approach 1:
The invention uses vertical stacking with conductive vias and through-hole structures that penetrate through each chip layer, creating robust three-dimensional interconnections. This approach improves reliability by establishing direct vertical signal paths and reducing dependence on extensive lateral substrate routing, while maintaining efficient space utilization.
Data Source
AI summary
According to an embodiment of the invention, a chip package is provided. The chip package includes a semiconductor substrate having an upper surface and an opposite lower surface, a through-hole penetrating the upper surface and the lower surface of the semiconductor substrate, a chip disposed overlying the upper surface of the semiconductor substrate, a conducting layer overlying a sidewall of the through-hole and electrically connecting the chip, a first insulating layer overlying the upper surface of the semiconductor substrate, a second insulating layer overlying the lower surface of the semiconductor substrate, and a bonding structure disposed overlying the lower surface of the semiconductor substrate, wherein a material of the second insulating layer is different from that of the first insulating layer.