Stackable Heat Riser With Elastic Blocks For Server Cooling

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Solution Overview

Problem

Existing cooling solutions for electronics, particularly in large-scale operations like server farms, face inefficiencies and compatibility issues, with air cooling being less effective and liquid cooling risking damage from leaks, and existing systems often requiring significant refactoring for upgrades.

Innovation Solution

A heat riser apparatus with adaptable, thermally conductive blocks and integrated vapor chambers that provide multi-axial elastic adjustment and secure heat dissipation, allowing for efficient cooling while minimizing risk of damage and requiring minimal system refactoring.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If liquid cooling solutions are used for direct contact with computer components, then heat dissipation efficiency is improved, but the risk of leaking and damaging components increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddamage risk from leaks

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a vapor chamber as an intermediary heat transfer medium between the computer component and the liquid cooling system. The vapor chamber absorbs heat from the component through evaporation and transfers it to the liquid coolant through condensation, eliminating direct contact between the liquid coolant and the component while maintaining efficient heat dissipation

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If advanced cooling solutions are integrated into existing systems, then cooling efficiency is improved, but system refactoring complexity increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidsystem refactoring requirements

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The cooling system is divided into separate modular components: a vapor chamber that attaches directly to the heat-generating component, and a separate liquid cooling loop with reservoir and pump. This segmentation allows the advanced cooling technology to be added as discrete modules without requiring complete system refactoring, maintaining compatibility with existing computer architectures

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The vapor chamber serves multiple functions: it acts as a heat spreader, phase change heat exchanger, and thermal interface all in one component. This multi-functionality reduces the number of separate components needed and simplifies integration with existing systems, as the vapor chamber can be attached to various component types without requiring system-wide modifications

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If separate cooling solutions are provided for each server in server racks, then cooling effectiveness is improved, but space efficiency decreases

Engineering Contradiction:

Improvecooling effectivenessVSAvoidspace efficiency

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent combines multiple cooling functions into an integrated system where a single liquid cooling loop serves multiple vapor chambers that are attached to different heat-generating components. The liquid coolant circulates through a common reservoir and pump, cooling multiple components simultaneously, thereby reducing the total space required compared to separate cooling systems for each component

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heat riser apparatus effectively manages heat dissipation across various server configurations, enhancing processing power and longevity while reducing the risk of damage and simplifying integration with existing systems.

Implementation Method 1

integrated vapor chambers that provide multi-axial elastic adjustment and secure heat dissipation

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

thermally conductive blocks that provide multi-axial elastic adjustment and secure heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

effectively manages heat dissipation across various server configurations

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 4

enhancing processing power and longevity while reducing the risk of damage

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11304343B1High-efficiency thermal management system and method

Publication Date: 2022.04.12 ADVANCED LIQUID COOLING TECHNOLOGIES INC

AI summary

A high-efficiency electronic thermal management system and method providing a heat riser having stackable blocks of thermally conductive material that include an upper block and a lower block, wherein the lower block has a lower surface mounted in thermal communication with a heat source. The lower block having an inclined upper surface configured to be in thermal communication with a block directly above, having a complemental inclined surface. These blocks are elastically coupled. The upper block may slide along the lower block allowing for vertical and horizontal axial elastic adjustment while providing consistent pressure to both the heat source and a cooling source to provide for heat dispersion along a thermal pathway from the heating source through the lower block, upper block, and to a cold plate cooling source. The cold plate also has internal fins and flowing liquid for heat dispersion.