Flexible Semiconductor Package Touch Sensing Alignment Detection
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Solution Overview
Problem
The challenge in semiconductor packages, such as chip on film (COF) packages, is that misalignment with the frame compromises heat dissipation, which can lead to reduced performance of the semiconductor chip due to inadequate thermal management.
Innovation Solution
Incorporating a touch sensing structure with conductive patterns and wires on a flexible base film that determines contact with the frame, allowing for proper alignment and ensuring effective heat dissipation by forming a conductive path when the package is correctly positioned.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor package is mounted on the display panel without alignment detection, then the assembly process is simple, but heat dissipation is compromised due to misalignment with the frame
Solution Approach 1:
The conductive pattern serves dual functions: it acts as part of the touch sensing structure for detecting user input, and simultaneously serves as an alignment detection element by forming a conductive path when the package is correctly positioned on the frame. This eliminates the need for separate alignment detection components.
Solution Approach 2:
The semiconductor package structure itself provides the alignment detection capability through its inherent conductive patterns and electrical connections. The package's own components (conductive patterns, wires, detector circuit) are used to detect its position relative to the frame, rather than requiring external detection systems.
2Reliability
If a touch sensing structure with conductive patterns is added to detect alignment, then heat dissipation is ensured through proper alignment detection, but the device complexity increases
Solution Approach 1:
The touch sensing structure's conductive patterns are repurposed to also serve as alignment detection elements. When the package is correctly positioned, the conductive pattern contacts the frame, completing an electrical circuit that signals proper alignment. This integration means the same structure performs both touch sensing and alignment verification functions.
Solution Approach 2:
The patent combines the touch sensing functionality with the alignment detection functionality into a single integrated system. The conductive patterns that detect touch inputs also detect the package's position on the frame by forming conductive paths when properly aligned, merging two functions into one unified structure.
3Ease of operation
If the conductive pattern is disposed through the base film, then the touch sensing capability is improved, but the manufacturing complexity increases
Solution Approach 1:
The conductive pattern is integrated into the flexible base film structure, utilizing the film's properties to accommodate the conductive elements. The thin film allows the conductive pattern to be disposed through it while maintaining flexibility and touch sensing capability, leveraging the inherent properties of flexible substrates.
Solution Approach 2:
The conductive pattern is nested within the base film structure, with the pattern disposed through the film rather than being a separate component. This nesting approach integrates the conductive elements into the existing film architecture, reducing the need for separate fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables accurate detection of the semiconductor package's alignment with the frame, ensuring efficient heat dissipation and maintaining the semiconductor chip's performance by preventing misalignment-related heat dissipation issues.
Implementation Method 1
a touch sensing structure including at least one conductive pattern adjacent to the semiconductor chip, the at least one conductive pattern being disposed through the base film and having a surface exposed at the second surface of the base film. The touch sensing structure may be included in an electrical path that determines whether or not the base film contacts a conductive frame supporting the semiconductor package.
Data Source
AI summary
A semiconductor package includes a flexible base film having a first surface opposing a second surface, a semiconductor chip mounted on the first surface of the base film, and a touch sensing structure including at least one conductive pattern adjacent to the semiconductor chip. The at least one conductive pattern is disposed through the base film and has a surface exposed at the second surface of the base film. A contact condition of the semiconductor package is determined based on detection of a conductive path between the at least one conductive pattern and a conductive frame or support surface of the semiconductor package. The contact condition provides an indication of heat dissipation that may be expected to occur for the chip during operation.