Tensioned Mesh for BGA Flux Extraction
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Solution Overview
Problem
During deep ball grid array (BGA) dipping, solder balls often get stuck in the flux, leading to inefficiencies in the manufacturing process due to the viscosity of the flux, which hinders their extraction.
Innovation Solution
A depth-adaptive mechanism with a tensioned mesh is positioned in the flux reservoir, which elastically deforms to provide an equal and opposite pushing force, facilitating the extraction of solder balls by applying a reaction force according to Hooke's Law and Newton's Third Law, preventing them from getting stuck.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If deep BGA dipping is performed to achieve proper flux coverage, then solder ball coverage is improved, but solder balls get stuck in the flux due to viscosity
Solution Approach 1:
A mesh structure is introduced as an intermediary element between the flux reservoir and the solder balls. The mesh provides mechanical support and facilitates solder ball extraction by preventing them from getting stuck in the viscous flux, while still allowing proper flux coverage to be achieved during deep dipping.
Solution Approach 2:
The mesh structure changes the physical parameters of the flux-solder ball interaction by providing a solid support surface. This alters the effective viscosity and flow characteristics of the flux in the dipping zone, enabling easier solder ball extraction while maintaining adequate flux coverage.
2Manufacturing precision
If deep BGA dipping is performed to ensure adequate flux coverage, then manufacturing quality is improved, but extraction time increases due to flux viscosity
Solution Approach 1:
The mesh acts as a mediator that decouples the dipping depth from extraction difficulty. It allows deep dipping for adequate flux coverage while providing a mechanical interface that reduces extraction time by preventing solder balls from becoming embedded in the viscous flux.
3Productivity
If tensioned mesh is added to facilitate solder ball extraction, then extraction efficiency is improved, but device complexity increases
Solution Approach 1:
A flexible mesh structure is used instead of a complex rigid mechanism. The mesh's elasticity and flexibility allow it to adapt to the dipping process while providing the necessary extraction assistance, simplifying the overall device structure compared to active mechanical systems.
Solution Approach 2:
The tensioned mesh is passively tensioned and automatically provides extraction assistance through its elastic properties. It self-regulates the extraction force based on the solder ball depth and flux viscosity without requiring external control systems, reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances manufacturing efficiency by ensuring smooth extraction of solder balls during deep BGA dipping, reducing the likelihood of them getting stuck in the flux and improving the reliability of the end-product.
Implementation Method 1
The tensioned mesh is configured to, first, elastically deform under the downward force applied by the one or more solder balls
Implementation Method 2
provide an equal and opposite pushing force in order to facilitate the extraction of the solder balls
Data Source
AI summary
This document describes systems and techniques of a depth-adaptive mechanism for ball grid array dipping. In an aspect, a depth-adaptive mechanism having a tensioned mesh is positioned in a reservoir filled with flux. When solder balls of an integrated circuit component are dipped into the reservoir of flux, the solder balls are pressed up against the tensioned mesh. The tensioned mesh is configured to, first, elastically deform under the downward force applied by the solder balls and, second, provide an equal and opposite pushing force in order to facilitate solder ball extraction. In so doing, the solder balls of an integrated circuit component can be more easily extracted from flux when deep ball grid array dipping is performed.