Diamond Heat Spreader Vias for IC Thermal Stress

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Solution Overview

Problem

High-power semiconductor integrated circuit devices face challenges in thermal management, leading to performance degradation and potential structural damage due to mismatched thermal expansion coefficients between IC dies and packaging structures, especially in high-power microwave devices that require effective heat dissipation and electrical grounding.

Innovation Solution

A packaged integrated circuit device featuring a diamond-based heat spreading substrate with an array of vias, which is electrically conductive and configured to overlap the edges of the IC die, providing superior thermal conductivity and mechanical compatibility while offering electrical grounding and reduced stress through symmetric via arrangement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional heat spreaders are used, then electrical grounding can be provided, but thermal stress and heat dissipation are insufficient due to mismatched thermal expansion coefficients

Engineering Contradiction:

Improvestructural integrityVSAvoidoperational temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent changes the material parameter of the heat spreader from conventional materials to diamond, which has superior thermal conductivity and thermal expansion properties that better match the IC die, thereby reducing thermal stress and improving heat dissipation while maintaining structural integrity

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs diamond-based composite materials for the heat spreader, combining the exceptional thermal properties of diamond with other materials to achieve both superior heat dissipation and electrical grounding capabilities while minimizing thermal expansion mismatch

Inventive Principle:

Principle #40Composite materials

2Temperature

If diamond-based heat spreader is used, then thermal conductivity is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidmanufacturing difficulty

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent segments the diamond-based heat spreader into multiple layers or zones with different via densities and configurations, allowing optimization of thermal management in different regions while simplifying the overall manufacturing process through modular construction

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces an array of vias creating a porous structure within the diamond-based heat spreader, which reduces material usage and manufacturing complexity while maintaining or enhancing thermal conductivity through optimized heat pathways

Inventive Principle:

Principle #31Porous materials

3Reliability

If vias are added to diamond substrate, then electrical grounding and stress reduction are achieved, but mechanical strength may be compromised

Engineering Contradiction:

Improveelectrical groundingVSAvoidmechanical strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies local quality by concentrating vias in specific regions where electrical grounding is most needed, while maintaining solid diamond structure in areas requiring maximum mechanical strength, thereby achieving both electrical functionality and structural integrity

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent performs preliminary strengthening of the diamond substrate around via regions through controlled material deposition or structural reinforcement before via formation, ensuring mechanical strength is maintained despite the presence of vias

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces thermal stress and enhances heat dissipation, improving the reliability and efficiency of high-power microwave devices by maintaining lower operational temperatures and increasing power-added efficiency.

Implementation Method 1

diamond-based heat spreading substrate...configured to spread heat generated by the MMIC die away from the MMIC die

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

diamond-based heat spreading substrate having an electrically conductive surface and an array of vias therethrough

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10658264B2Diamond-based heat spreading substrates for integrated circuit dies

Publication Date: 2020.05.19 ANALOG DEVICES INC

AI summary

The disclosed technology generally relates to integrated circuit (IC) packages, and more particularly to integrated circuit packages comprising perforated diamond-based heat spreading substrates. In one aspect, a heat spreading substrate for an IC die is configured to be attached to an IC die and to spread heat away therefrom. The diamond-based heat spreading substrate can have an electrically conductive surface and an array of vias formed therethrough. At least one of the vias is configured to overlap an edge of the IC die when attached to the diamond-based heat spreading substrate.