Side Solderable Lead IC Package with Mold Groove
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Solution Overview
Problem
Modern electronics require increased functionality in integrated circuit packages with reduced physical size and cost, but existing technologies fail to adequately address the need for lower height, smaller size, and cost reduction while maintaining connectivity and performance.
Innovation Solution
The method involves a leadframe with side solderable leads having a half-etched portion and a mold body formed directly on the leadframe, with a mold groove created to expose the lead protrusion on the upper perimeter side and the half-etched lead portion on the lower perimeter side, using laser ablation for precise shaping and singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing manufacturing methods and equipment are used, then cost is reduced, but package dimensions cannot be reduced
Solution Approach 1:
The patent transitions from traditional bottom-soldered leads to side-soldered leads, changing the spatial dimension of solder connection. This dimensional shift allows the package to achieve smaller footprint area while maintaining connectivity, resolving the contradiction between reduced package dimensions and manufacturing compatibility
Solution Approach 2:
The leadframe is segmented with specific portions removed to expose side leads for soldering. This segmentation allows selective exposure of lead portions, enabling side soldering while maintaining structural integrity, thus achieving both cost-effective manufacturing and reduced package size
2Adaptability or versatility
If leadframe portions are removed to expose side leads, then connectivity is enhanced, but manufacturing complexity increases
Solution Approach 1:
The leadframe is pre-configured with specific portions removed before molding, exposing side leads in advance. This preliminary action simplifies subsequent manufacturing steps by eliminating the need for complex post-molding lead exposure processes, thus enhancing connectivity while controlling manufacturing complexity
Solution Approach 2:
Specific portions of the leadframe are selectively removed to expose only the necessary side leads for soldering. This local quality approach ensures that connectivity is enhanced at the required locations without unnecessarily complicating the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances connectivity, manufacturing yield, and operational performance by providing additional surface area for solder connections, reducing short circuits, and simplifying the manufacturing process, while maintaining reliability and flexibility.
Implementation Method 1
removing a portion of the mold body and a portion of the side solderable lead for forming a mold groove in the mold body to expose a lead protrusion
Data Source
AI summary
A system and method of manufacture of an integrated circuit packaging system includes: a leadframe having a side solderable lead with a half-etched lead portion and a lead top side; a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body; a mold groove in the mold body and in a portion of the side solderable lead for exposing a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and the half-etched lead portion exposed from a lower perimeter side of the mold body.