Circuit Package Metal Block Thermal Management

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Solution Overview

Problem

Semiconductor chip packages face issues with high thermal and electrical resistance, low component reliability, and high processing costs due to poor cooling design and serial processing methods.

Innovation Solution

A circuit package design featuring a metal block adjacent to the electronic circuit with encapsulation material in between, and electrically conductive media connecting the metal block to double-sided metal layer structures, allowing for optimal cooling and reduced thermal and electrical resistance through parallel processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional chip package cooling design is used, then manufacturing simplicity is maintained, but thermal resistance increases and cooling efficiency decreases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidpackage structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent transitions from traditional planar cooling designs to a three-dimensional configuration where metal blocks are positioned adjacent to the electronic circuit in the lateral dimension. This spatial arrangement creates direct thermal coupling between the heat-generating circuit and the metal heat sinks, enabling efficient heat dissipation through vertical and lateral thermal pathways simultaneously, thereby resolving the contradiction between cooling efficiency and structural complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If serial single processes are used for chip package production, then process simplicity is maintained, but processing time increases and productivity decreases

Engineering Contradiction:

Improveprocessing speedVSAvoidprocessing complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent combines multiple previously separate processing steps into integrated parallel operations. The metal layer structures are formed and electrically contacted to both sides of the electronic circuit simultaneously, and the encapsulation material is applied in a single step that completes both mechanical support and electrical insulation functions. This merging of functions and processes eliminates sequential bottlenecks, thereby increasing productivity while managing processing complexity through systematic integration.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If traditional electrical contact methods are used, then material consistency is maintained, but electrical resistance increases

Engineering Contradiction:

Improveelectrical contact reliabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent employs composite material structures for electrical contacts, where metal layer structures with varying compositions and properties are strategically positioned on both sides of the electronic circuit. These composite contact structures optimize electrical conductivity and mechanical bonding strength simultaneously, achieving superior electrical contact reliability while the standardized layering process keeps manufacturing complexity manageable through repeatable fabrication steps.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances cooling efficiency, reduces thermal and electrical resistance, and increases component reliability by enabling optimal exposure of contacts and minimizing processing steps, thus lowering costs and improving manufacturing efficiency.

Implementation Method 1

the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

A circuit package design featuring a metal block adjacent to the electronic circuit with encapsulation material in between... allowing for optimal cooling and reduced thermal and electrical resistance

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11189537B2Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit

Publication Date: 2021.11.30 INFINEON TECHNOLOGIES AG

AI summary

A circuit package is provided, the circuit package including: an electronic circuit; a metal block next to the electronic circuit; encapsulation material between the electronic circuit and the metal block; a first metal layer structure electrically contacted to at least one first contact on a first side of the electronic circuit; a second metal layer structure electrically contacted to at least one second contact on a second side of the electronic circuit, wherein the second side is opposite to the first side; wherein the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium; and wherein the electrically conductive medium includes a material different from the material of the first and second metal layer structures or has a material structure different from the material of the first and second metal layer structures.