Mixed Resin Underfill for 3D TSV Packages
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Solution Overview
Problem
Current methods for preparing wafer-level underfill for three-dimensional through-silica via (TSV) packages face challenges in achieving optimal thermal expansion matching, curing efficiency, and die corner coverage, particularly in the context of mixed resin systems.
Innovation Solution
A mixed resin system comprising an epoxy resin, a maleimide, nadimide or itaconamide, an acrylate, and a filler, where the epoxy resin is often siloxane-modified, is used to create a composition that cures into a three-dimensional polymer network, modulating the coefficient of thermal expansion and providing suitable melt viscosity and gelling temperature ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single resin system is used for wafer-level underfill, then the formulation is simple, but it cannot achieve optimal thermal expansion matching and curing efficiency simultaneously
Solution Approach 1:
The patent employs a composite resin system combining epoxy, maleimide, and acrylate components to achieve optimal thermal expansion matching and curing efficiency. The epoxy provides structural integrity and thermal stability, the maleimide contributes to thermal expansion matching, and the acrylate enables efficient curing, creating a synergistic formulation that outperforms single-resin systems.
Solution Approach 2:
The patent modifies the epoxy resin with siloxane groups to adjust the coefficient of thermal expansion to match the substrate. This chemical modification changes the physical and thermal parameters of the base resin, enabling precise tailoring of thermal expansion properties while maintaining the resin's fundamental characteristics.
2Manufacturing precision
If conventional resin systems are used, then the manufacturing process is simple, but die corner coverage and gap filling are insufficient
Solution Approach 1:
The patent adjusts the viscosity and gelling temperature parameters of the resin formulation to optimize die corner coverage and gap filling. By controlling the melt viscosity within a specific range and setting the gelling temperature between 130-180°C, the formulation achieves proper flow characteristics that enable complete coverage of die corners and effective gap filling during the underfill process.
3Productivity
If the curing temperature is increased to improve curing efficiency, then the curing speed increases, but the thermal stability of the underfill deteriorates
Solution Approach 1:
The patent optimizes the curing temperature parameter to balance curing efficiency and thermal stability. By establishing a gelling temperature range of 130-180°C and controlling the curing process within this window, the formulation achieves adequate curing speed while maintaining the thermal stability required for TSV package applications, avoiding the degradation that would result from excessive temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves effective die corner coverage, gap filling, and electrical interconnect joint formation, with underfill films demonstrating improved thermal stability and adhesion properties, suitable for TSV packages.
Implementation Method 1
an epoxy resin which can cure into a three-dimensional polymer network
Implementation Method 2
a maleimide which can undergo radical cure to form a polymeric network
Implementation Method 3
an acrylate which can undergo radical cure to form a polymeric network
Implementation Method 4
a filler which modulates the coefficient of thermal expansion (CTE) of the resulting composition
Data Source
AI summary
Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.