Multilayer Ceramic Substrate Penetration Electrode Coplanarity
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Solution Overview
Problem
Integrated passive devices with passive elements on multilayer ceramic substrates face challenges in achieving coplanarity of connecting terminals, leading to issues with chip mounting and the formation of small-sized electronic components due to varying terminal heights caused by protruding penetration electrodes.
Innovation Solution
A multilayer ceramic substrate with penetration electrodes and an insulating film having openings above the electrodes, where first connecting terminals are formed on the insulating film to cover these openings and are electrically connected to the electrodes, and second connecting terminals are formed on the insulating film in regions other than the openings, ensuring uniform height and improved coplanarity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connecting terminals are formed on the multilayer ceramic substrate in regions corresponding to penetration electrodes, then electrical connection is achieved, but the heights of connecting terminals vary and coplanarity deteriorates
Solution Approach 1:
An insulating film is introduced as an intermediary layer between the penetration electrode and the connecting terminal. This insulating film has an opening that exposes the penetration electrode, allowing the connecting terminal to be formed while maintaining a uniform surface. The intermediary layer resolves the conflict between achieving electrical connection and maintaining coplanarity by providing a controlled interface.
Solution Approach 2:
The solution moves from a two-dimensional surface problem to a three-dimensional structure by forming the connecting terminal that covers the opening in the insulating film. This vertical arrangement allows the terminal to make electrical contact through the opening while the top surface remains coplanar with other terminals formed on the insulating film surface.
2Manufacturing precision
If connecting terminals are formed in regions other than penetration electrode regions to maintain coplanarity, then coplanarity is improved, but it becomes difficult to form small-sized electronic components
Solution Approach 1:
By utilizing the vertical dimension through the opening in the insulating film, the connecting terminal can be positioned directly above the penetration electrode without increasing the horizontal footprint. This allows small-sized components to be formed while maintaining coplanarity, as the electrical connection is achieved through the vertical opening rather than lateral expansion.
3Reliability
If the coplanarity of connecting terminals is poor, then chip mounting becomes unreliable, but achieving good coplanarity requires avoiding penetration electrode regions
Solution Approach 1:
The insulating film with an opening serves as a mediator that enables both good coplanarity and reliable chip mounting. The opening allows the connecting terminal to be formed over the penetration electrode while the insulating film material provides a uniform surface that ensures coplanarity, thereby achieving both mounting reliability and manufacturing precision simultaneously.
Data Source
AI summary
An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that is provided on the insulating film so as to cover the opening, and is electrically connected to the penetration electrode; and a second connecting terminal that is provided on a region of the insulating film other than the opening region.