Printed Circuit Details TRIZ Cases

Elastic contact transmission medium transfers applied forces to a pressure transducer for spatial measurement.

Divided printed wiring layers at the sealing interface reduce thermal deformation of flexible substrates, maintaining waterproof integrity during molding.

Roughened inner insulation surfaces anchor composite outer layers, preventing warping and bending under thermal stress.

Through-holes in a bent flexible printed circuit board reduce internal stress, while pins passing through these holes prevent separation from adhesive tape.

A display substrate integrates specific binding pins in the non-display area to connect signal lines and touch electrodes directly.

A semiconductor substrate with a staircase bottom surface and varying connecting portion heights enables reliable electrical connections on curved module substrates.

MW-band power chokes reduce input capacitance while meeting CISPR 25 class 5 emission requirements.

Embedding external connection pads in one insulating layer creates flat bonding surfaces, resolving the contradiction between fine pitch and bondability.

Shielding wall pillars surround conductor pillars to block electrical fields, resolving signal integrity issues caused by electromagnetic interference.

Differential laser transmittance removes organic base material layers without thermally damaging the optical waveguide.

Segmented wiring portions guide flexible printed circuit board movement, suppressing disconnection caused by reversed bending directions.

Flexible printed circuits mount sensors and LEDs in elastomeric cavities to resolve the trade-off between device functionality and structural fragility.

Twisting patterns exchange signal positions to cancel coupling effects, suppressing IQ imbalances and boosting bandwidth without extra power.

Segmented light source units coupled via a relay member enable high-definition luminance distribution while reducing device weight and material usage.

Nested lead frame with angled end faces dissipates chip heat while maintaining structural integrity under pressure.

A circuit module uses overlapping shielding wires connected to a shared ground terminal pad on the substrate.

Spring blades on a cover press a radiator against a component, eliminating adhesive incompatibility issues and improving heat transfer reliability.

A hollow flexible bobbin core measures current signals without magnetic saturation, reducing device weight and manufacturing cost.

Embedding an EM-tunnel within PCB layers reduces impedance loss and interference by replacing micro-strip lines with waveguide transmission.

Single metal interlayer separates radio frequency channels without mechanical fasteners.

Laser folding transforms planar PCBs into complex 3D electronics by reducing metal reflectivity, eliminating expensive self-folding equipment.

Conductive member positioned closer to terminals than their separation absorbs AC noise, preventing resonance and chip damage during high-density mounting.

Thin-film metal stacks paired with silicon dioxide masks prevent solder wicking and oxide formation on LTCC substrates.

A modular intelligent clothing system uses magnetic induction to connect functional boards to a main board for flexible placement.

Segmenting a flexible substrate allows peripheral circuits to bend behind the display, eliminating the glass support and achieving a frameless design.

Nested shielding members in bonded substrates resolve conflicts between integration density and terminal formation.

Soldered abutment members prevent adhesive cracks and refrigerant leakage in semiconductor cooling interposers.

An insulating film with openings above penetration electrodes enables uniform connecting terminal heights on multilayer ceramic substrates.

Reducing differential pair contact intervals resolves HDMI 2.1 impedance matching issues while maintaining ground signal spacing.

Plated through vias link symmetrical memory chip pins to center layer traces, eliminating T-branch topology and reducing signal transmission line effects.

A heat dissipation structure uses stacked thermal interface materials with distinct fluidity to manage heat transfer.

An inclined mirror support integrated on a substrate reflects optical signals from a waveguide, reducing device size and manufacturing complexity.

A flexible display apparatus uses a variable thickness organic film in its encapsulation unit to manage mechanical stress during bending operations.