Flexible Substrate Array for Frameless Display via Laser Release
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Solution Overview
Problem
Current display technologies cannot achieve a super narrow frame or eliminate the frame entirely, as they require a minimum frame width of 1mm due to the production methods used for Fanout, chip on glass (COG), and flexible printed circuit (FPC) pads on glass substrates.
Innovation Solution
An array substrate is designed with a flexible substrate comprising a first region for the display array and a second region for the peripheral circuit, where the flexible substrate bends to allow the peripheral circuit and driving chip to be attached to the backside of the display screen, utilizing a releasing layer that gasifies with laser energy for separation, enabling the glass substrate to be cut and removed, thus eliminating the need for a frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If Fanout, chip on glass (COG), or flexible printed circuit (FPC) pads are produced on a glass substrate, then the display can be manufactured with conventional methods, but the frame width must be kept above 1mm and cannot achieve super narrow frame or frameless design
Solution Approach 1:
The flexible substrate is divided into a first region (display area) and a second region (peripheral circuit area), allowing independent positioning and bending of each region. This segmentation enables the peripheral circuits to be moved to the backside of the display, achieving super narrow or frameless design while maintaining conventional manufacturing methods for the display array.
Solution Approach 2:
The peripheral circuits are moved from the front plane to the backside of the display by bending the flexible substrate in the third dimension. This dimensional transition allows the frame width to be reduced to nearly zero while keeping all necessary circuit components accessible and functional.
2Length of stationary object
If the flexible substrate is bent to move peripheral circuits to the backside, then super narrow frame or frameless design is achieved, but the structural complexity increases
Solution Approach 1:
A flexible substrate made of thin film material is used to replace the rigid support structure. This flexible substrate can be bent without breaking, allowing the peripheral circuits to be positioned on the backside of the display while maintaining structural integrity. The thin film nature keeps the overall device complexity manageable despite the three-dimensional configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of a display apparatus with a super narrow frame, or even without a frame, by bending the flexible substrate and its components to the backside of the display screen, reducing the edge area width and achieving a more compact design.
Implementation Method 1
a releasing layer located between the glass substrate and the flexible substrate and comprises a material which is able to gasify by absorbing laser energy
Data Source
Figure 1(A)~1(B)
Figure 2~3
Figure 4(A)~4(B)
AI summary
The present disclosure provides an array substrate, a method for producing the same, a display panel and a display apparatus. The array substrate comprises: a glass substrate; a flexible substrate comprising a first region and a second region, the glass substrate being supported on a lower surface of the first region of the flexible substrate and the second region projecting from the first region towards the external of the glass substrate; a display array formed on the first region of the flexible substrate; and a peripheral circuit formed on the second region of the flexible substrate. The array substrate can achieve a display apparatus with super narrow frame, even without frame.