Circuit Module Shielding Wire Pad Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing circuit module designs that use wires for shielding electronic components require multiple pads on the substrate, leading to a reduction in the area available for mounting components due to the need for multiple connections, which increases the complexity and reduces the space for other components.
Innovation Solution
A circuit module configuration where first wires connect a ground terminal of a first component to the substrate at one point, allowing the second component to be shielded by overlapping wires, reducing the number of pads needed and enhancing the shielding effect by connecting multiple wires to the same ground terminal, thereby minimizing area occupation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If wires are used to shield electronic components by connecting to the substrate at both ends, then shielding effect is improved, but the number of pads required increases, reducing the mounting area
Solution Approach 1:
Multiple shielding wires that would normally require separate pads are merged to share a common pad on the substrate. The patent shows multiple wires (first wires and second wires) connecting to the same pad, thereby reducing the total number of pads required while maintaining shielding effectiveness through the combined wire structure
Solution Approach 2:
The common pad serves multiple functions by being the connection point for multiple shielding wires simultaneously. This multi-functional pad design allows the substrate to support several shielding elements without requiring proportionally more connection points, thus preserving mounting area
2Reliability
If multiple pads are formed on the substrate to connect shielding wires, then wire connection reliability is improved, but the area for mounting electronic components decreases
Solution Approach 1:
The patent combines multiple wire connections to share common pads, reducing the total pad count from what would be required if each wire had dedicated pads. This merging approach maintains connection reliability through proper wire-to-pad bonding while freeing up substrate area for component mounting
Data Source
AI summary
To provide a circuit module capable of suppressing a decrease in an area for mounting an electronic component on a substrate even when a wire for shielding the electronic component is connected to the substrate. A circuit module according to the present disclosure includes a substrate, a first component mounted on the substrate and including a ground terminal on an upper surface, first wires that connect the ground terminal to the substrate, and a second component mounted on the substrate, in which overlapping first wires in plan view.