Printed Wiring Board Reinforced Insulation Layer Warping Prevention
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Solution Overview
Problem
Printed wiring boards with resin insulation layers lack sufficient strength and rigidity, leading to bending or warping under external stresses such as heat and vibration.
Innovation Solution
A multilayer printed wiring board is manufactured with a core substrate, an inner insulation layer having a roughened surface, and an outer insulation layer reinforced with fiber, which provides enhanced rigidity and anchoring effects to prevent warping and bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If insulation layers are made of resin only, then the wiring board can be formed with high wiring density and integration, but the strength and rigidity become insufficient causing bending or warping under external stresses
Solution Approach 1:
The patent applies composite materials by combining resin with reinforcing materials (such as glass fibers or other inorganic fillers) to create an insulation layer that maintains the electrical insulation properties of resin while gaining the mechanical strength and rigidity of the reinforcing materials. This composite structure prevents bending and warping under external stresses like heat and vibration, while still allowing high wiring density and integration.
2Strength
If a multilayer structure with core substrate and reinforced outer insulation layer is used, then strength and rigidity are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the insulation layer into two distinct parts: an inner insulation layer made of resin for electrical insulation, and an outer insulation layer made of composite material with reinforcing materials for mechanical strength. This segmentation allows each layer to perform its specific function optimally while maintaining a manageable manufacturing process through sequential formation.
Solution Approach 2:
The patent applies local quality by giving different material compositions to different regions of the insulation structure. The inner insulation layer uses pure resin where electrical insulation is critical, while the outer insulation layer uses composite material where mechanical strength is required. This localized differentiation optimizes performance without unnecessarily complicating the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the structural integrity of the printed wiring board, preventing warping and bending due to external stresses by sandwiching the inner layers between a core substrate and a rigid outer insulation layer, ensuring improved durability and reliability.
Implementation Method 1
A surface of the inner insulation layer is treated to form a roughened portion on the surface
Data Source
AI summary
A printed wiring board is manufactured by a method in which a core substrate having an insulation substrate and a conductive circuit formed on the insulation substrate is provided. An inner insulation layer is formed on the core substrate, and a surface of the inner insulation layer is treated to form a roughened portion on the surface. An outer insulation layer including a reinforcing material is formed on the surface of the inner insulation layer having the roughened portion.