Interconnection Structure With Shielding Wall Pillar For Signal Integrity
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Solution Overview
Problem
Traditional via structures in substrates face challenges in signal transmission integrity due to impedance mismatch and electromagnetic interference (EMI), particularly at higher frequencies, as they lack effective return paths and fail to control dispersive electrical fields effectively.
Innovation Solution
An interconnection structure is introduced, featuring a conductor pillar and a shielding wall pillar with distinct cross-sectional shapes, where the shielding wall pillar is electrically connected to a reference conductive wire and positioned to surround the conductor pillar, effectively blocking electrical fields and enhancing electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a traditional via structure is used for signal transmission, then the structure is simple and easy to manufacture, but the signal transmission integrity deteriorates due to impedance mismatch and electromagnetic interference at higher frequencies
Solution Approach 1:
The traditional single via structure is segmented into two distinct components: a conductor pillar for signal transmission and a shielding wall pillar for electromagnetic shielding. This segmentation allows each component to perform its specific function optimally, resolving the contradiction between structural simplicity and signal integrity by dividing the via into specialized segments.
Solution Approach 2:
Different regions of the interconnection structure are assigned different properties: the conductor pillar uses materials and dimensions optimized for electrical conductivity and signal transmission, while the shielding wall pillar uses materials and dimensions optimized for electromagnetic shielding. This local differentiation resolves the contradiction by providing appropriate properties in appropriate locations.
2Reliability
If at least two vias are designed (one signal via and one ground via) to provide return path, then the signal transmission integrity is improved, but the device complexity increases
Solution Approach 1:
The signal transmission function and the electromagnetic shielding function are merged into a single interconnection structure consisting of the conductor pillar and shielding wall pillar. This merging resolves the contradiction by combining what were previously separate via functions into one integrated structure, maintaining signal integrity while reducing the number of discrete components needed.
Solution Approach 2:
The interconnection structure with conductor pillar and shielding wall pillar serves multiple functions simultaneously: it provides signal transmission, electromagnetic shielding, and return path functionality all in one structure. This multi-functionality resolves the contradiction by eliminating the need for separate signal via and ground via configurations.
3Object-affected harmful factors
If the shielding wall pillar is added to surround the conductor pillar, then the electromagnetic shielding is enhanced and electrical field leakage is reduced, but the manufacturing complexity increases
Solution Approach 1:
The shielding wall pillar extends in the vertical dimension between the first and second conductive layers, creating a three-dimensional shielding structure around the conductor pillar. This dimensional approach resolves the contradiction by providing effective electromagnetic shielding through vertical placement rather than requiring complex lateral arrangements, making the structure more manufacturable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces electrical field leakage and improves signal integrity by controlling impedance and dispersive electrical fields, thereby minimizing EMI and ensuring reliable signal transmission across the substrate.
Implementation Method 1
the shielding wall pillar is disposed between the first conductive layer and the second conductive layer and electrically connected to a reference conductive wire, in which the shielding wall pillar is located at a portion of an external region surrounding the conductor pillar between the first conductive layer and the second conductive layer
Data Source
AI summary
An interconnection structure is disposed between a first conductive layer and a second conductive layer substantially parallel to each other. The conductive layer includes a signal trace. The interconnection structure includes a conductor pillar and a shielding wall pillar. The conductor pillar goes through between the two conductive layers and is electrically connected to the signal trace of the first conductive layer. The shielding wall pillar is also disposed between the two conductive layers and located at a portion of an external region surrounding the conductor pillar and electrically coupled to the conductor pillar. The conductor pillar and the shielding wall pillar are disposed in pair or in group. The shielding wall pillar with a shape different from that of the conductor pillar would make the conductor pillar serve as a connection with a designed impedance and the capability of controlling impedance based on the special shape design thereof.