Laser Folding 3D Electronics via Thermal Buckling
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Solution Overview
Problem
Existing patterning techniques for electronic devices are limited to planar substrates, resulting in large areal footprints, and require expensive special equipment for self-folding technologies.
Innovation Solution
A method of laser folding a two-dimensional printed circuit board, using a laser to create three-dimensional electronic devices by reducing the reflectivity of the metal layer and employing temperature gradient and buckling mechanisms for folding, allowing for the formation of complex 3D structures with integrated electronics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If manual folding techniques are used to transform planar substrates into three-dimensional structures, then the areal footprint is reduced, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces manual mechanical folding techniques with laser-induced thermal folding. The laser beam creates localized temperature gradients that cause the substrate to fold automatically through thermal expansion and buckling mechanisms, eliminating the need for manual manipulation and complex mechanical folding equipment.
Solution Approach 2:
The patent changes the physical state and properties of the substrate by applying localized thermal energy. By controlling laser parameters (power, speed, pulse duration) and adjusting substrate properties (material composition, thickness, metal layer characteristics), the substrate undergoes controlled thermal transitions that enable automatic folding into three-dimensional structures.
2Area of stationary object
If self-folding technologies are used to create three-dimensional structures, then the areal footprint is reduced, but expensive special equipment is required
Solution Approach 1:
The patent replaces expensive specialized self-folding equipment with a standard laser system. The laser induces thermal effects that trigger automatic folding through the substrate's inherent physical properties (thermal expansion, buckling), eliminating the need for complex mechanical self-folding apparatus while achieving the same three-dimensional transformation.
Solution Approach 2:
The substrate performs the folding action itself through laser-induced thermal mechanisms. The metal layer and substrate material automatically respond to localized heating by undergoing thermal expansion and buckling, causing self-folding without requiring external mechanical actuators or specialized self-folding equipment.
3Illumination intensity
If laser folding is used with metal layers, then the reflectivity of laser light increases, but the folding efficiency decreases
Solution Approach 1:
The patent converts the harmful effect of high laser light reflectivity (which reduces heating efficiency) into a beneficial effect. By carefully controlling the laser parameters and metal layer properties, the reflected light is managed to prevent excessive heat buildup that could cause unwanted effects, while still achieving sufficient localized heating for controlled folding. The metal layer's reflectivity is thus transformed from an obstacle into a controllable parameter for precise thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the rapid and cost-effective fabrication of complex three-dimensional electronic devices, such as antennas and sensors, by transforming 2D printed circuit boards into 3D structures while maintaining electrical connectivity, using a single low-cost laser for cutting and folding.
Implementation Method 1
one or more upward folds via a temperature gradient mechanism of the printed circuit board
Implementation Method 2
one or more downward folds via a buckling mechanism of the printed circuit board
Implementation Method 3
oxidizing the surface of the metal layer
Implementation Method 4
laser roughening the surface of the at least one metal layer
Data Source
AI summary
A novel methodology of forming a three-dimensional electronic device according to various embodiments of the present invention is described. The methodology comprises, at least, a step of laser folding, using only a laser, a two-dimensional electrically insulating printed circuit board at least partially covered with at least one metal layer, with the laser impinging upon the at least one metal layer to make one or more folds of the printed circuit board to form a three-dimensional electronic device structure.