Power Module Lead Frame Design for Thermal and Structural Optimization
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Solution Overview
Problem
Power modules face challenges in maintaining small size while increasing power density due to heat accumulation and structural weaknesses, leading to potential chip damage and reduced performance.
Innovation Solution
A power module design featuring a lead frame with angled end faces and multiple mounting lateral surfaces between two circuit boards, embedded in an encapsulation body with electrode tabs, and a heat sink system with coolant flow channels to enhance heat dissipation and structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the housing is made hollow to reduce size, then the size of the module is reduced, but the housing becomes prone to collapse under pressure causing chip or connection line damage
Solution Approach 1:
The housing is divided into an upper housing and a lower housing that are separated and connected through side walls, creating a segmented structure. This segmentation allows the housing to maintain structural integrity while accommodating multiple chips and reducing overall size, as each segment can be independently optimized for its function.
Solution Approach 2:
The chips are nested within the hollow housing structure, with multiple chips arranged in layers between the upper and lower housings. The lead frame is nested within the housing, providing structural support while accommodating the chips. This nesting approach maximizes space utilization and maintains structural strength without increasing module size.
2Reliability
If support columns are added inside the housing to prevent collapse, then structural integrity is improved, but the size of the module is increased
Solution Approach 1:
The lead frame serves multiple functions: it provides structural support to prevent housing collapse, acts as an electrical connection carrier between chips and external circuits, and facilitates heat dissipation. This multi-functionality eliminates the need for separate support columns, maintaining structural integrity while minimizing module size.
Solution Approach 2:
The support function and electrical connection function are merged into a single component - the lead frame. Instead of having separate support columns and connection leads, the lead frame integrates both functions, reducing the number of components and minimizing the module's overall size while maintaining structural strength.
3Power
If the power of chips is increased to improve power density, then power output is improved, but heat accumulation increases causing temperature rise and reduced operation efficiency
Solution Approach 1:
The lead frame acts as an intermediary heat dissipation path between the chips and the external environment. Heat generated by the high-power chips is conducted through the lead frame's connection portions to the upper and lower housings, which then dissipate the heat to the external environment. This intermediary heat transfer mechanism enables high power density while controlling chip temperature.
Solution Approach 2:
The upper and lower housings serve as thin film heat dissipation structures that conduct heat away from the chips. These housing structures provide a large surface area for heat dissipation relative to the compact module size, enabling effective thermal management while maintaining high power density and small form factor.
4Adaptability or versatility
If a large number of leads are used to connect chips on a flat substrate, then connectivity is improved, but the manufacturing complexity and housing size are increased
Solution Approach 1:
The chips are arranged in multiple layers vertically between the upper and lower housings, transitioning from a traditional two-dimensional flat arrangement to a three-dimensional stacked configuration. This dimensional change reduces the number of leads required for connectivity while maintaining comprehensive electrical connections, simplifying manufacturing and reducing housing size.
Solution Approach 2:
Multiple electrical connection functions are merged into the lead frame structure, which provides both mechanical support and electrical connectivity. The lead frame's connection portions integrate the wiring functions that would otherwise require numerous separate leads, reducing manufacturing complexity while maintaining full chip connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design increases power density, improves pressure resistance, and effective heat dissipation, reducing the risk of chip damage and maintaining operational efficiency.
Implementation Method 1
a heat sink system including the power module
Implementation Method 2
effective heat dissipation
Data Source
AI summary
Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.