Interposer Flow Path Refrigerant Leakage Prevention
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Solution Overview
Problem
The existing methods for cooling semiconductor chips using refrigerant-filled substrates are prone to refrigerant leakage due to cracks in the adhesive agents, such as resin, which can occur due to environmental conditions or aging, leading to operational failures.
Innovation Solution
An interposer configuration with a substrate having a flow path, inflow, and outflow ports, where the pipes connecting the refrigerant are secured using solder to prevent leakage, with abutment and connection members ensuring a secure fit and reducing the risk of refrigerant escape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive agents such as resin are used to connect pipes to substrate, then ease of manufacture is improved, but reliability deteriorates due to cracks forming under environmental stress and aging
Solution Approach 1:
The patent changes the connection method from adhesive bonding to mechanical connection via abutment members. The abutment member with a smaller opening provides mechanical support and positioning, while the connection member creates a secure mechanical joint that prevents cracks from forming under thermal stress and aging, thus improving reliability while maintaining manufacturing ease
Solution Approach 2:
The connection structure combines multiple materials and components: the abutment member provides mechanical support, the connection member creates the secure joint, and the adhesive agent is still used but in a controlled manner where it won't crack. This composite approach leverages the strengths of each material to achieve both ease of manufacture and high reliability
2Device complexity
If adhesive agents are used to secure pipes, then device complexity is reduced, but refrigerant leakage risk increases due to cracking under thermal stress
Solution Approach 1:
The patent introduces abutment members with smaller openings that provide mechanical support and positioning for the pipes. This mechanical structure prevents the adhesive from cracking under thermal stress, thereby preventing refrigerant leakage while adding only minimal structural complexity
Solution Approach 2:
The abutment member is positioned beforehand to provide mechanical support and stress distribution before the adhesive is applied. This pre-positioned support cushions against thermal expansion and contraction forces, preventing crack formation and refrigerant leakage before they can occur
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents refrigerant leakage, enhancing the reliability and efficiency of semiconductor chip cooling by securely connecting the refrigerant pipes to the substrate, thus maintaining the integrity of the cooling system.
Implementation Method 1
A cooling medium flows through the flow path. The cooling medium flows into the flow path through the inflow port. The cooling medium flows out of the flow path through the outflow port.
Implementation Method 2
The first connection member connects the first abutment member to the inner surface of the flow path. The second connection member connects the second abutment member to the inner surface of the flow path.
Data Source
AI summary
Electrodes pads formed on device surfaces connect semiconductor chips to through electrodes of an intermediate substrate. A flow path is formed inside the intermediate substrate. A cooling medium flows through the flow path. Stoppers are attached to an inner surface of the flow path. The stoppers include metal abutment members, respectively. An end of each pipe abuts against the counterpart abutment member. Solder connects the pipes to the abutment members.