Staircase Substrate for Reliable Flexible Semiconductor Mounting
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Solution Overview
Problem
There is a need for semiconductor modules and packages that can be mounted reliably on flexible substrates with curved profiles, which is challenging due to the varying heights and thicknesses of connecting portions, and the demand for smaller and lighter electronic devices is increasing.
Innovation Solution
The semiconductor module design includes a module substrate with a curved section and connecting portions of varying heights and thicknesses on a staircase-shaped bottom surface, allowing for reliable electrical connection and mounting on substrates with complex geometries, and the use of a mold layer to secure the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connecting portions are made to accommodate curved substrate profiles, then mounting reliability on flexible substrates is improved, but device complexity increases due to varying heights and thicknesses
Solution Approach 1:
The substrate is designed with locally varied thickness and connecting portion heights at specific regions to match the curved profile of flexible substrates. This localized adaptation allows the package to conform to curved surfaces while maintaining a simple overall structure, resolving the contradiction between mounting reliability and device complexity.
Solution Approach 2:
The substrate incorporates curved surfaces and varying thickness profiles that match the curvature of flexible substrates. This curvature design enables reliable mounting on bent surfaces by ensuring uniform contact and electrical connection, while the curvature itself becomes the solution rather than adding complex mechanical adaptation mechanisms.
2Reliability
If substrate thickness is increased to accommodate varying connecting portion heights, then electrical connection reliability is improved, but device weight increases
Solution Approach 1:
The substrate thickness is selectively increased only at regions where connecting portions require greater height to accommodate curved profiles. Other regions maintain minimal thickness, ensuring electrical connection reliability where needed while minimizing overall weight addition.
Solution Approach 2:
Instead of uniformly increasing substrate thickness in one dimension, the design varies thickness in specific localized regions. This dimensional differentiation allows the substrate to provide necessary connection heights only where required, maintaining overall weight efficiency while ensuring electrical reliability.
3Adaptability or versatility
If connecting portions have varying heights, then adaptability to curved substrates is improved, but manufacturing precision requirements increase
Solution Approach 1:
The substrate is pre-formed with varying thickness and connecting portion heights during the manufacturing process. This preliminary structuring allows the varying heights to be built-in as part of the substrate fabrication rather than requiring post-processing or assembly adjustments, reducing the precision demands on subsequent manufacturing steps.
Solution Approach 2:
The substrate design incorporates controlled variations in thickness and connecting portion heights as intentional geometric parameters. By defining these variations as design parameters rather than tolerances, the manufacturing process can systematically produce the varying heights with standard precision, improving adaptability without excessively tightening precision requirements.
Data Source
AI summary
Provided are semiconductor modules and semiconductor packages. The semiconductor module may include a module substrate and a semiconductor package mounted on the module substrate. The semiconductor package may include a substrate with a top surface and a bottom surface. Here, the top surface of the substrate may be flat and the bottom surface of the substrate may include a first region and a second region positioned at a lower level than the first region. The semiconductor package may further include connecting portions which are provided on the bottom surface of the substrate and electrically connected to the module substrate.