Double-Sided Electronic Module With Nested Shielding
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Solution Overview
Problem
The challenge in manufacturing double-sided mounting-type electronic device modules is the difficulty in forming external connection terminals and shielding films that effectively shield electromagnetic waves while maintaining a compact and high-performance design.
Innovation Solution
The solution involves a double-sided mounting configuration where electronic devices are mounted on both surfaces of a substrate, with a second substrate bonded to the first, featuring a shielding member integrated into a molded portion to accommodate and shield electronic devices, and a manufacturing method that includes forming external connection terminals using a separate substrate and embedding a shielding member within a molded portion to prevent electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electronic components are mounted on both surfaces of a substrate to increase integration density, then the degree of integration is improved, but it becomes difficult to form external connection terminals and shielding films
Solution Approach 1:
The substrate is divided into two separate substrates: a first substrate for mounting electronic components and a second substrate for forming external connection terminals and accommodating shielding members. This segmentation allows each substrate to be optimized for its specific function, resolving the conflict between high integration density and ease of manufacturing connection terminals and shielding films.
2Object-affected harmful factors
If a shielding film is formed to shield electromagnetic waves, then electromagnetic shielding is improved, but the device size and complexity increase
Solution Approach 1:
The shielding member is disposed inside the device accommodating part of the second substrate, nested within the modular structure. This nesting approach provides effective electromagnetic shielding while maintaining a compact form factor and avoiding the need for additional external shielding layers that would increase device complexity.
3Adaptability or versatility
If external connection terminals are formed on the substrate, then connectivity is improved, but it becomes difficult to maintain compact device size
Solution Approach 1:
External connection terminals are formed on the second substrate which is bonded to the opposite surface of the first substrate from the electronic components. This spatial arrangement in another dimension allows multiple connection terminals to be packed in a compact area without increasing the overall device volume, while still providing adequate connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances integration density, facilitates easier formation of external connection terminals, and effectively shields electromagnetic waves, ensuring reliable operation and protection of electronic devices from external impacts and electromagnetic interference.
Implementation Method 1
a shielding member shielding electromagnetic waves from being introduced into the electronic device disposed in the device accommodating part and/or shielding electromagnetic waves from being leaked from the electronic device
Implementation Method 2
a second substrate bonded to the surface of the first substrate
Data Source
AI summary
An electronic device module includes a first substrate having at least one or more electronic devices mounted on one surface thereof, a second substrate bonded to one surface of the first substrate and including at least one device accommodating part having a space in which the electronic device is accommodated, and a shielding member disposed in the device accommodating part and accommodating at least one or more electronic devices therein.