Inclined Mirror Support for Semiconductor Waveguide Integration
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Solution Overview
Problem
Existing semiconductor devices with integrated optical components face challenges in achieving compact dimensions while effectively coupling and reflecting optical signals, leading to inefficiencies in optical data transfer and processing.
Innovation Solution
A semiconductor device with a substrate, dielectric layer, and an inclined mirror support integrated on the substrate, where a mirror region is formed on the surface of the dielectric layer to reflect optical signals efficiently, using high-density plasma deposition of oxide for the mirror support and reflective materials like gold or silver for the mirror layer, allowing for compact integration and precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If separate optical components are used for coupling and reflecting optical signals, then optical functionality is achieved, but device size and complexity increase
Solution Approach 1:
The patent combines multiple optical functions (coupling mirror and reflecting mirror) into a single integrated optical component formed within the semiconductor device structure. This single component performs both coupling of external optical signals into waveguides and reflection of optical signals within the device, eliminating the need for separate optical components and reducing overall device size while maintaining optical functionality.
2Volume of moving object
If optical components are integrated into semiconductor devices, then compact dimensions are achieved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces complex mechanical alignment and assembly processes with a planar integrated structure formed through semiconductor manufacturing techniques. The optical component is formed as a planar structure with defined coupling and reflecting surfaces that are integrated into the semiconductor substrate, eliminating the need for precise mechanical alignment of separate optical components and simplifying the manufacturing process.
3Reliability
If mirror surfaces are added to improve optical reflection, then optical performance is enhanced, but manufacturing steps increase
Solution Approach 1:
The patent uses a composite structure where the optical component is formed with different material regions (first material for coupling surface, second material for reflecting surface) that provide optimized optical properties for each function. This composite material approach allows the component to achieve high optical reflection efficiency for both coupling and reflecting functions while being formed through standard semiconductor manufacturing processes like selective epitaxial growth.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables compact, efficient optical signal reflection and transfer within the semiconductor device, enhancing optical performance and reducing the need for separate optical components, thus improving the integration of electronic and optical functions.
Implementation Method 1
a mirror support (5) integrated on the substrate, having a surface (15) facing the waveguide (3), wherein a mirror is formed on the surface (15) of the mirror support (5)
Implementation Method 2
The mirror support is a high-density plasma deposited oxide
Data Source
Figure 1~2
Figure 3~5
Figure 6~8
AI summary
The semiconductor device comprises a substrate (1) of semiconductor material, a dielectric layer (2) above the substrate, a waveguide (3) arranged in the dielectric layer, and a mirror region (4) arranged on a surface of a mirror support (5) integrated on the substrate. A mirror is thus formed facing the waveguide. The surface of the mirror support and hence the mirror are inclined with respect to the waveguide.