Ceramic Substrate Silver Region Bonding Strength
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Solution Overview
Problem
The light-emitting element mounting substrates disclosed in existing technologies have low bonding strength between the substrate main body and the metal portion, leading to peeling issues with the metal portion.
Innovation Solution
A light-emitting element mounting substrate is developed using a ceramic sintered body with a silver-containing metal portion, where a silver-containing region is formed on the substrate main body to enhance bonding strength by increasing the adhesion between the substrate and the metal portion, thereby improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a metal portion is formed on the substrate main body, then reflectance is improved, but bonding strength between substrate and metal portion deteriorates
Solution Approach 1:
The patent applies composite materials by creating a silver-containing region within the substrate that combines the ceramic substrate material with silver particles. This composite structure provides both the reflectance of metal (silver) and the bonding strength of the ceramic substrate, resolving the contradiction between improving reflectance and maintaining bonding strength.
Solution Approach 2:
The silver-containing region acts as an intermediary between the substrate main body and the metal portion. It serves as a bonding interface that enhances adhesion while maintaining high reflectance, mediating between the substrate and metal portion to prevent peeling.
2Reliability
If metal portion is bonded to substrate, then electrical conductivity is improved, but reliability deteriorates due to peeling
Solution Approach 1:
The silver-containing region is formed within the substrate before the metal portion is applied. This preliminary action creates a pre-prepared bonding interface that ensures strong adhesion and prevents peeling, improving bonding reliability and stability before the metal portion is actually bonded.
3Strength
If silver-containing region is formed in substrate, then bonding strength is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the formation of the silver-containing region with the substrate manufacturing process itself. By incorporating silver particles into the ceramic slurry before sintering, the silver-containing region is created as an integral part of the substrate, avoiding additional manufacturing steps and reducing overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases the bonding strength between the substrate and the metal portion, reducing peeling and maintaining high reflectance, thus enhancing the reliability and performance of the light-emitting device.
Implementation Method 1
a silver-containing region existing in a portion of the substrate main body which faces the metal portion across a bonding portion bonding the substrate main body and the silver-containing metal portion
Data Source
Figure 1~2
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AI summary
There are provided a light-emitting element mounting substrate having high bonding strength between a substrate main body and a metal portion, and a light-emitting device having high bonding strength between the substrate main body and the metal portion and high reliability. A light-emitting element mounting substrate includes a substrate main body (20) formed of a ceramic sintered body; and a silver-containing metal portion (2), a silver-containing region (4) existing in a portion of the substrate main body which faces the metal portion across a bonding portion bonding the substrate main body and the silver-containing metal portion. Accordingly, it is possible to increase bonding strength between the substrate main body (20) and the metal portion (2).