Circuit Optical Details TRIZ Cases

Transparent substrate components route in-air optical signals between printed wiring boards.

Photosensitive resin composition uses a photoacid generator with controlled absorption limit to form optical waveguide core layers.

Silver-containing region in ceramic substrate prevents peeling by increasing bonding strength with metal portion.

A light-shielding conductive layer on a flexible wiring board prevents light leakage through the base film while maintaining reduced mount structure thickness.

Mesh electrode terminals balance conductivity and visibility by preventing light shielding in touch panel sensing regions.

A conductive film uses a mesh pattern with optimized projection wiring to maintain uniform density on transparent substrates.

A total internal reflection sub-assembly integrates a pre-aligned lens and optical turning member to reduce stack height.

Through-holes in the printed board reduce weight while a reflective cover maintains light efficiency for large displays.

A connection carrier uses metallic contact tracks arranged in a network structure on a transparent substrate to provide electrical conductivity.

Reactive sputtering with CO2 forms a stable CuOx darkening layer that reduces reflection and glare, improving visibility in large-area touch screens.

Segmenting the over cladding layer with grooves prevents curing shrinkage warpage, ensuring flat mounting surfaces for optical elements.

A chip part substrate features a roughened second main surface that diffusely reflects light to minimize reflection direction biases.

Dummy cores and lenses enable automatic camera inspection to resolve low contrast issues in polymer waveguide mass production.

Physical embedding of functional additives into host material surfaces resolves mixing uniformity and adhesion issues while maintaining surface finish.

Near-infrared LEDs on flexible circuits illuminate eyes to resolve gaze accuracy versus diverse user anatomy trade-offs.

Segmented wiring layers with a sub-metal backup allow main metal removal during defective light source replacement without breaking electrical continuity.

A light guide conducts indicator light parallel to a circuit board edge to display status without occupying vertical space.

A protective layer applied to the transition area of a functional film contact flap prevents tears during injection molding.

A conductive film uses a copper nitride pattern layer to maintain low sheet resistance while ensuring chemical stability under high temperature and humidity.

Plating prevention films shield reflective layers from electroless plating solutions, preserving reflectance ratio during LED module manufacturing.

Recessed multilayer wiring enables low-profile component mounting without additional release steps, reducing manufacturing cost and material waste.

An integral polymer body with surface grooves forms graphic structures without a substrate, eliminating thickness and adhesive separation issues.

A transparent mesh grid integrates radiation conductors and dummy patterns to maintain uniform light transmittance.

Refractive index tuning in functional layers suppresses hue variation in large touch panels.

A hybrid electro-optical circuit board uses a metal layer on the inner wall of its light guiding hole to reflect optical signals.

A pattern forming method uses electroplating to deposit a conductive film on target portions of a printed intermediate.

A solder resist composition uses dual photopolymerization initiators to ensure thorough curing of deep layers containing titanium dioxide.

A surface mount spacer elevates and tilts electronic components on a printed circuit board.

Forming wiring parts before electrode parts prevents fabrication damage and improves adhesion between conductive layers.

A conductive structure connects multiple signal pads to reduce impedance in thin electronic devices.

Transparent substrate and regions enable bidirectional emission, resolving directional limits in flip-chip LEDs.