Optical Element Sealing Layer for IC Substrate
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Solution Overview
Problem
Current optical communication systems face challenges in maintaining the reliability of optical signal transmission due to dust and foreign matter intrusion into the optical path, which can obstruct signal transmission.
Innovation Solution
A substrate for mounting IC chips is designed with conductor circuits and insulating layers, featuring an optical element sealing layer that contacts the periphery of the optical element, and optionally includes a cap member to cover the optical element, preventing dust and foreign matter from entering the optical path. The optical path is formed to penetrate through insulating and solder resist layers, with a resin composite and particles like alumina, silica, or titania used to enhance sealing and transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the optical path is exposed for signal transmission, then optical communication can be achieved, but dust and foreign matter can intrude and obstruct the signal
Solution Approach 1:
The patent applies a sealing layer (resin film) that covers and seals the optical element and optical path. This thin film structure prevents dust and foreign matter from intruding into the optical path while allowing optical signals to pass through, thus resolving the contradiction between maintaining open optical paths for communication and preventing contamination
Solution Approach 2:
The sealing layer acts as an intermediary between the optical path and the external environment. It mediates by providing a protective barrier that blocks harmful particles while maintaining the functionality of the optical communication system, thus preventing dust intrusion without compromising signal transmission
2Reliability
If the optical element is sealed to prevent dust intrusion, then reliability improves, but the structure becomes more complex
Solution Approach 1:
The patent merges the sealing function with the existing substrate structure by forming the sealing layer as an integrated part of the substrate assembly. The sealing layer is formed to cover the optical element and seal the optical path, combining protection with the mounting substrate into a unified structure that reduces overall complexity
Solution Approach 2:
The sealing layer serves multiple functions simultaneously: it seals the optical path to prevent dust intrusion, provides structural support for the optical element, and maintains the integrity of the substrate assembly. This multi-functionality reduces the need for separate components, thereby simplifying the overall device structure while improving reliability
Data Source
AI summary
The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.