Inkjet Printed Sensor Integration for Bezel Reduction
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Solution Overview
Problem
Existing electronic devices face challenges in maximizing screen size due to the bezel region, which is necessary for input/output signal transmission and is not easily reducible without compromising functionality.
Innovation Solution
A method of manufacturing electronic devices using a mold with a projection portion to form layers through inkjet printing, allowing for the integration of electronic modules within the display module, thereby reducing the bezel region by incorporating sensor regions within the display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the bezel region is reduced to maximize screen size, then the display area increases, but the reliability of signal transmission and device functionality deteriorates
Solution Approach 1:
The patent merges the electronic module housing with the display module by integrating the sensor region directly into the display area. The sensor layer is formed on the display panel within the display region, eliminating the need for a separate bezel region to house sensors. This integration maintains signal transmission reliability while maximizing the display area.
Solution Approach 2:
The patent transitions from a planar bezel-based sensor housing to a multi-layered structure where sensors are embedded within the display panel itself. By stacking the sensor layer, display layer, and touch layer in vertical arrangement, the patent achieves sensor integration without compromising the display area or signal transmission reliability.
2Area of moving object
If the bezel region is reduced, then the screen size utilization improves, but the complexity of integrating electronic modules increases
Solution Approach 1:
The patent combines multiple functions (display, sensing, touch input) into a single integrated display module. The sensor region is formed directly on the display panel using the same manufacturing process, eliminating the need for separate housing and integration steps for electronic modules, thus reducing overall device complexity.
Solution Approach 2:
The display panel serves multiple functions: it displays visual information, detects touch input, and houses sensor components. This multi-functionality is achieved by forming the sensor layer and display layer in an integrated structure, reducing the need for separate electronic modules and simplifying the overall device architecture.
3Area of moving object
If sensor regions are integrated within the display area, then the bezel region is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The patent forms the sensor layer and conductive patterns on the display panel before final assembly, using preliminary patterning steps that define the sensor region boundaries. This preliminary action ensures precise alignment and positioning of sensor components within the display area, meeting high manufacturing precision requirements while enabling bezel region reduction.
Solution Approach 2:
The patent replaces traditional mechanical alignment and housing-based positioning with inkjet printing and photolithography techniques for precise material deposition. These advanced manufacturing techniques enable sub-millimeter precision in forming sensor layers and conductive patterns, achieving the required manufacturing precision for integrated display modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and flexibility of electronic device manufacturing by reducing the bezel region, improving screen size utilization while maintaining functionality through the integration of sensor regions within the display area.
Implementation Method 1
forming, in the first opening, a first layer including a first material through an inkjet printing method
Implementation Method 2
the forming of the first layer in the mold may include heating the mold at a predetermined temperature
Implementation Method 3
the forming of the first layer in the mold may include irradiating the mold with ultraviolet rays
Data Source
AI summary
A method of manufacturing an electronic device includes providing a mold with a first opening defined therein and including a projection portion disposed in the first opening, forming, in the first opening, a first layer including a first material through an inkjet printing method, disposing the mold on a display panel in a way such that the first opening faces the display panel, and forming a display module by removing the mold. The display module is provided with a second opening defined therein and corresponding to the projection portion.