Conductive Structure for Thin Electronic Device Signal Transmission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current electronic devices face challenges in achieving a thinner conductive layer with lower impedance to ensure uniform signal transmission, which is difficult to achieve without increasing the number of circuit boards or compromising on space, especially in designs with narrow frames.
Innovation Solution
The electronic device incorporates a conductive structure that connects multiple signal pads to a conductive layer, using materials like gold or silver to reduce impedance and enhance signal transmission efficiency, allowing for thinner layers and reduced circuit board usage while maintaining signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the conductive layer is reduced, then the device can achieve a thinner and more compact design, but the impedance of the conductive layer increases causing uneven signal transmission
Solution Approach 1:
The patent applies local quality by creating a conductive structure with non-uniform thickness - the conductive layer is thicker at the signal pad locations and transitions to a thinner thickness in intermediate regions. This local variation in thickness allows the structure to maintain low impedance at critical signal transmission points while achieving overall thinness for compact device design, thereby resolving the contradiction between thinness and signal transmission uniformity
Solution Approach 2:
The patent changes the thickness parameter of the conductive layer from a uniform value to a spatially varying value. By controlling the thickness to be greater at signal pads and smaller in between, the impedance parameter is optimized locally to ensure uniform signal transmission while maintaining overall thinness, thus resolving the technical contradiction
2Reliability
If the number of circuit boards is increased to reduce impedance, then signal transmission improves, but the cost and device complexity increase
Solution Approach 1:
The patent merges the functions of multiple circuit boards into a single integrated conductive structure. By forming a continuous conductive layer that connects multiple signal pads on one substrate, the invention eliminates the need for separate circuit boards while maintaining low impedance and uniform signal transmission, thus resolving the contradiction between signal quality and device complexity
Solution Approach 2:
The conductive structure serves multiple functions simultaneously: it acts as a conductive layer for signal transmission, provides mechanical support, and connects multiple signal pads. This multi-functionality replaces what would traditionally require multiple separate circuit boards, reducing complexity while maintaining signal transmission quality
3Reliability
If more space is allocated on the array substrate for conductive structures, then impedance is reduced, but the frame width increases compromising narrow frame design
Solution Approach 1:
The patent transitions from a two-dimensional planar conductive structure to a three-dimensional structure with varying thickness. By utilizing the vertical dimension to create non-uniform thickness distribution, the invention achieves effective impedance control without requiring additional horizontal space on the substrate, thus enabling narrow frame design while maintaining signal transmission quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient voltage signal transmission with lower impedance, reducing the need for multiple circuit boards and allowing for thinner, more compact device designs with improved signal uniformity and brightness in light-emitting units.
Implementation Method 1
The conductive structure is disposed on the first signal pads, and at least two of the first signal pads are electrically connected to each other through the conductive structure
Data Source
AI summary
An electronic device includes a first substrate, a first conductive layer, a plurality of first electrode pads, a plurality of first light-emitting units, a plurality of first signal pads and a conductive structure. The first conductive layer is disposed on the first substrate. The first electrode pads are disposed on the first conductive layer. The first light-emitting units overlap and are disposed on the first electrode pads. The first light-emitting units are electrically connected to the first electrode pads respectively. The first signal pads are disposed on the first conductive layer and electrically connected to the first conductive layer. The conductive structure is disposed on the first signal pads, and at least two of the first signal pads are electrically connected to each other through the conductive structure.