Pattern Forming Method for Conductive Film
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Solution Overview
Problem
Existing pattern forming methods struggle to efficiently remove discontinuous portions while maintaining low resistance, which affects the transparency and conductivity of conductive patterns.
Innovation Solution
A pattern forming method involving a printing step to create a pattern intermediate with a plating target portion and a discontinuous portion, followed by an electroplating treatment using a solution with multiple metal salts and a complexing agent, where the discontinuous portion is selectively removed, forming a pattern with a plating film on the target portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a discontinuous portion is removed from a pattern intermediate, then transparency is improved, but resistance increases
Solution Approach 1:
The patent applies preliminary electroplating treatment to the pattern intermediate before final pattern formation. This preliminary plating deposits metal on both the continuous pattern portions and discontinuous portions, maintaining conductivity during the removal process. The plating layer is formed in advance so that when discontinuous portions are later removed, the resistance remains low because the plating provides a conductive pathway.
Solution Approach 2:
The patent changes the physical and chemical parameters of the pattern intermediate through electroplating treatment. By controlling plating conditions (current density, time, solution composition), the resistance of the pattern is optimized. The plating process transforms the electrical properties of the pattern intermediate, enabling discontinuous portions to be removed while maintaining low resistance through the deposited metal layer.
2Illumination intensity
If a discontinuous portion is removed from a pattern intermediate, then transparency is improved, but the pattern structure becomes more complex
Solution Approach 1:
The patent selectively extracts (removes) only the discontinuous portions from the pattern intermediate while preserving the continuous pattern structure. This extraction is achieved through controlled electroplating and subsequent processing, where discontinuous portions are identified and removed based on their electrical isolation characteristics, simplifying the final pattern structure while improving transparency.
Solution Approach 2:
The electroplating process acts as an intermediary step between pattern formation and final pattern completion. This intermediary treatment modifies the pattern intermediate by depositing metal on conductive portions, creating a differentiated structure that facilitates selective removal of discontinuous portions. The plating process mediates the transformation from a complex intermediate structure to a simplified final pattern.
3Illumination intensity
If electroplating treatment is applied to remove discontinuous portions, then transparency is improved, but the process time increases
Solution Approach 1:
The patent applies partial electroplating treatment, targeting only specific portions of the pattern intermediate rather than treating the entire structure uniformly. By controlling the plating parameters and duration, the treatment is applied just sufficiently to achieve the desired effect of enabling discontinuous portion removal, avoiding excessive processing time while still improving transparency effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for easy removal of discontinuous portions, improving the transparency and conductivity of the pattern by forming a plating film on the target portion while maintaining low resistance.
Implementation Method 1
performing an electroplating treatment using a plating solution containing at least two or more types of metal salts containing different types of metals and a complexing agent
Implementation Method 2
the discontinuous portion of the pattern intermediate is removed to form a pattern constituted by the plating target portion covered with a plating film
Data Source
AI summary
A pattern forming method capable of easily removing a discontinuous portion in a pattern while keeping resistance of the pattern low. A pattern forming method including at least a printing step of printing a pattern intermediate containing a conductive material on a base material 1, and a plating step of subjecting the pattern intermediate to an electroplating treatment, in which the pattern intermediate printed in the printing step has a plating target portion that is energized in the plating step and a discontinuous portion that is discontinuously formed from the plating target portion and is not energized in the plating step, and in the plating step, by performing an electric field plating treatment using a plating solution containing at least two or more types of metal salts containing different types of metals and a complexing agent, the discontinuous portion of the pattern intermediate is removed to form a pattern constituted by the plating target portion covered with a plating film.