Glass Interconnection Substrate Curved Waveguide Alignment
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Solution Overview
Problem
The challenge in high-bandwidth optical communication systems is the high cost and low throughput associated with active alignment processes required for maintaining proper alignment between optical transceiver devices and connectors, particularly due to the decreasing size of optical components and increasing bandwidth demands.
Innovation Solution
The use of flexible glass interconnection substrates with curved portions and integrated optical waveguides that can be easily aligned and secured between optical components, eliminating the need for active alignment processes by providing low coupling loss and high alignment tolerances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment processes are used to maintain proper alignment between optical transceiver devices and connectors, then alignment precision is improved, but manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent applies preliminary action by pre-aligning and securing the optical waveguide to the glass interconnection substrate during substrate fabrication, before the actual optical connection assembly is made. The waveguide is positioned and fixed in its correct orientation relative to the substrate surface, so that when the substrate is later inserted into the optical connector, the alignment is already established, eliminating the need for time-consuming active alignment processes during final assembly.
Solution Approach 2:
The glass interconnection substrate acts as an intermediary component between the optical waveguide and the optical connector. The substrate provides a mechanical platform that holds the waveguide in a predetermined position, and this intermediate structure enables straightforward alignment with the optical connector without requiring complex active alignment mechanisms.
2Manufacturing precision
If active alignment processes are used to maintain proper alignment between optical transceiver devices and connectors, then alignment precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies preliminary action by pre-aligning and securing the optical waveguide to the glass interconnection substrate during substrate fabrication, before the actual optical connection assembly is made. The waveguide is positioned and fixed in its correct orientation relative to the substrate surface, so that when the substrate is later inserted into the optical connector, the alignment is already established, eliminating the need for time-consuming active alignment processes during final assembly.
3Volume of moving object
If the size of optical transceiver devices is decreased, then device miniaturization is achieved, but alignment tolerance decreases
Solution Approach 1:
The glass interconnection substrate acts as an intermediary component between the optical waveguide and the optical connector. The substrate provides a mechanical platform that holds the waveguide in a predetermined position, and this intermediate structure enables straightforward alignment with the optical connector without requiring complex active alignment mechanisms.
Solution Approach 2:
The glass interconnection substrate employs a flexible design with a curved portion that can bend to accommodate misalignments and thermal expansion differences between components. This flexibility compensates for the reduced alignment tolerance inherent in miniaturized devices, maintaining reliable optical coupling despite size constraints.
4Stability of the object's composition
If rigid interconnection structures are used, then structural stability is improved, but adaptability to thermal expansion mismatches decreases
Solution Approach 1:
The glass interconnection substrate employs a flexible design with a curved portion that can bend to accommodate misalignments and thermal expansion differences between components. This flexibility compensates for the reduced alignment tolerance inherent in miniaturized devices, maintaining reliable optical coupling despite size constraints.
Solution Approach 2:
The patent explicitly addresses thermal expansion mismatches between the glass interconnection substrate and the optical connector. The flexible curved portion of the substrate is designed to accommodate differential thermal expansion, allowing the structure to adapt when components expand or contract at different rates due to temperature changes, thereby maintaining structural integrity and optical alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces costs and improves throughput by enabling reliable, low-loss optical interconnections with high optical interconnection density and flexibility to accommodate thermal expansion mismatches between components.
Implementation Method 1
an optical waveguide at least partially positioned within the curved portion
Data Source
AI summary
Optical interconnection assemblies, glass interconnection substrates, and methods for making optical connections are disclosed. In one embodiment, an optical interconnection assembly includes a base substrate, a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide having an end surface, an optical chip comprising an optical coupling surface, and a glass interconnection substrate. The glass interconnection substrate includes a first end optically coupled to the end surface of the substrate optical waveguide, a second end optically coupled to the optical coupling surface of the optical chip, and a curved portion disposed between the first end and the second end. The glass interconnection substrate further includes an optical waveguide at least partially positioned within the curved portion.