Filament LED with Transparent Substrate for Bidirectional Light
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Solution Overview
Problem
Existing filament type light emitting devices with flip-chip type light emitting diode chips are limited in their ability to emit light in both forward and backward directions due to the reflective layer on the sapphire substrate, making it difficult to achieve wide-angle light distribution.
Innovation Solution
A light emitting device structure utilizing a non-conductive transparent substrate with conductive transparent connection portions and light transmitting regions between the substrate and light emitting diode chips, allowing for both forward and backward light emission without additional reflectors, and enabling the use of flip-chip type light emitting diode chips in light emitting bulbs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a reflective layer is applied to the sapphire substrate of flip-chip type light emitting diode chips, then light emission in one direction is enhanced, but light emission in the backward direction is blocked
Solution Approach 1:
The invention extracts and removes the reflective layer from the sapphire substrate of the flip-chip type light emitting diode chip. By taking out this reflective layer, the patent enables light to be emitted in both forward and backward directions, resolving the contradiction between enhanced directional light emission and blocked backward light emission.
Solution Approach 2:
The invention inverts the conventional approach by removing the reflective layer that normally blocks backward light. Instead of adding reflective structures to enhance backward emission, the patent achieves bidirectional light emission by eliminating the obstacle (reflective layer) that prevents backward light transmission.
2Adaptability or versatility
If multiple light emitting devices are arranged to distribute light at desired angles, then light distribution is improved, but the number of devices and complexity increase
Solution Approach 1:
The invention makes each light emitting device universal by enabling it to emit light in both forward and backward directions simultaneously. This multi-functionality allows a single device to perform the work of multiple devices, achieving wide-angle light distribution without increasing the number of devices or system complexity.
Solution Approach 2:
The invention adds a new dimension to light emission by enabling backward light transmission in addition to forward emission. This dimensional change allows light to be distributed in multiple directions from a single device, achieving complex light distribution patterns without requiring multiple devices arranged in specific geometries.
3Ease of manufacture
If flip-chip type light emitting diode chips are used with reflective layers, then manufacturing is simplified, but backward light emission is prevented
Solution Approach 1:
The invention extracts and removes the reflective layer from the flip-chip type light emitting diode chip structure. This extraction maintains the manufacturing simplicity of flip-chip technology while eliminating the barrier to backward light emission, allowing light to pass through the sapphire substrate in both directions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables light emitting devices to emit a significant amount of light in both forward and backward directions, improving light distribution and efficiency in light emitting bulbs by eliminating the need for additional reflectors and allowing for the use of flip-chip type light emitting diode chips.
Implementation Method 1
light transmitting regions are provided in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips and light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate
Implementation Method 2
conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends
Data Source
AI summary
Filament type light emitting devices are disclosed. One of the light emitting devices includes a non-conductive transparent substrate, one or more light emitting diode chips arrayed above the upper surface of the non-conductive transparent substrate and each including input and output ends extending toward the non-conductive transparent substrate, and conductive transparent connection portions formed on the upper surface of the non-conductive transparent substrate and electrically connected to the input and output ends. Light transmitting regions are provided without reflectors in the vicinity of the input and output ends between the non-conductive transparent substrate and the light emitting diode chips. Thus, light is emitted backward from the light emitting diode chips through the light transmitting regions and the non-conductive transparent substrate.