Ceramic Susceptor RF Electrode Layout for Uniform Heat Transfer
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Solution Overview
Problem
Existing susceptors in semiconductor manufacturing apparatuses face challenges in controlling uniformity of the distance between the ceramic plate and the metal mesh RF electrode, leading to variations in ion concentration and heat dissipation, which affects wafer performance, and require expensive joining methods for connecting the ceramic and cooling plates.
Innovation Solution
A susceptor design with a metal layer on the ceramic plate as an RF electrode, a heat transfer space sealed by a seal member, and an RF conduction member connecting the metal layer to the cooling plate, allowing for inexpensive construction and effective heat transfer while suppressing in-plane distance variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal mesh is embedded in the ceramic plate as an RF electrode, then the RF function is achieved, but the metal mesh undulates due to flexibility causing in-plane variation of distance between the ceramic plate and metal mesh
Solution Approach 1:
The patent uses a flexible metal mesh as the RF electrode that can be conformally attached to the ceramic plate surface. The flexibility of the thin metal mesh allows it to adapt to the ceramic plate while maintaining electrical contact, resolving the contradiction between achieving RF function and maintaining distance uniformity.
2Temperature
If an expensive joining method such as metal diffusion joining is used to connect the ceramic plate and cooling plate, then high heat removal property is achieved, but the manufacturing cost increases
Solution Approach 1:
The patent replaces expensive metal diffusion joining with a simpler, more cost-effective joining method that uses readily available materials and processes. The cooling plate and ceramic plate are connected using an affordable joining technique that still achieves the required heat removal performance without the high manufacturing costs of diffusion joining.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves cost-effective suppression of in-plane distance variations, ensuring consistent RF function and efficient heat removal without expensive joining methods, thereby improving wafer performance and reducing manufacturing costs.
Implementation Method 1
an RF conduction member provided at a position on an inner peripheral side of the seal member between the ceramic plate and the cooling plate, and configured to secure electric connection between the metal layer and the cooling plate
Implementation Method 2
a heat transfer space present between the metal layer and the cooling plate, and configured to enable heat transfer through gas
Data Source
AI summary
There is provided a susceptor including: a ceramic plate including a first surface and a second surface; an internal electrode embedded in the ceramic plate; a metal layer provided as an RF electrode on an entirety or a part of the second surface of the ceramic plate; a cooling plate provided at a predetermined distance from the second surface; a heat transfer space present between the metal layer and the cooling plate, and configured to enable heat transfer through gas; a seal member provided along outer peripheries of the ceramic plate and the cooling plate between the ceramic plate and the cooling plate, to impart airtightness to the heat transfer space; and an RF conduction member provided at a position on an inner peripheral side of the seal member between the ceramic plate and the cooling plate to secure electric connection between the metal layer and the cooling plate.