Ceramic Susceptor Electrode Connector for Stable Rod Brazing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing electrode-rod connections in wafer processing apparatuses are prone to degradation due to heat expansion, cooling contraction, and physical stress, leading to potential disconnection and loss of bonding, which is exacerbated by the use of larger electrodes to reduce impedance.
Innovation Solution
A dome-shaped electrode connector is formed within a ceramic material, with a portion drilled out to flatten the surface for a larger contact area, allowing a rod to be bonded securely using brazing, thereby increasing the bonding area to at least 5 mm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a larger electrode is used to reduce impedance and strengthen bonding, then the bond strength between electrode and rod is improved, but the manufacturing difficulty increases due to higher risk of cracks
Solution Approach 1:
The patent applies preliminary action by forming a dome-shaped electrode connector inside the ceramic material before final assembly. This pre-formed dome structure allows for controlled stress distribution during subsequent drilling and bonding operations, preventing cracks while achieving the required bond strength. The dome shape is created in advance to facilitate the later drilling process and ensure structural integrity.
Solution Approach 2:
The patent employs spheroidality by using a dome-shaped electrode connector instead of a flat or angular structure. The curved dome shape distributes mechanical and thermal stresses more evenly throughout the ceramic material, reducing the risk of crack formation at vertices or sharp edges. This curvature is maintained throughout the manufacturing process and is essential for achieving both strength and manufacturability.
2Area of stationary object
If a dome-shaped electrode connector is formed inside ceramic material, then the bonding area is increased, but the manufacturing process complexity increases due to additional drilling and flattening steps
Solution Approach 1:
The patent applies segmentation by dividing the electrode connector into two distinct functional zones: a dome-shaped upper portion that provides stress distribution and a flattened lower portion that provides the bonding surface. This segmentation allows each zone to optimize its specific function while simplifying the overall manufacturing approach. The drilling operation selectively removes material to create the flat bonding surface without compromising the dome structure's stress-distributing capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the stability and reduces thermal and physical stress on the electrode-rod connection, ensuring a stronger bond and lower impedance, minimizing the risk of disconnection during wafer processing.
Implementation Method 1
bonding a rod into a remaining part of the electrode connector
Data Source
AI summary
A method of providing a stable connector used in a deposition apparatus is presented. The method may comprise forming a dome-shaped electrode connector inside of a ceramic material, drilling out a part of the ceramic material along with a portion of the dome-shaped electrode connector to flatten the electrode connector; and bonding a rod into a remaining part of the electrode connector. The method would provide a stable electrode connector which could hold the entire length of the rod which is bonded onto it. The length of the flattened electrode connector could be 5 mm.