Ceramic Component Metal Terminal Stress Distribution
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Solution Overview
Problem
Ceramic electronic components with metal terminals face detachment issues under high-temperature environments due to the softening of lead-free solder and concentration of external stress, leading to a decrease in bond strength and potential detachment.
Innovation Solution
A ceramic electronic component design featuring a metal terminal with a base, ribs, and a mounting portion, where the base includes a bonding portion and a cut-out portion that distributes external stress, preventing concentration and maintaining bond strength through diffusion bonding and rib reinforcement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If lead-free high-temperature solder is used to bond the metal terminal to the main body, then the bond strength at ordinary temperatures is improved, but the bond strength significantly decreases under high-temperature environments exceeding 125°C
Solution Approach 1:
The patent replaces the mechanical/solder-based bonding system with a diffusion-bonding system. Instead of relying on solder joints that soften at high temperatures, the metal terminal is diffusion-bonded directly to the external electrode, creating a metallurgical bond that maintains strength at elevated temperatures up to 150°C and beyond.
Solution Approach 2:
The patent changes the bonding mechanism from solder-based mechanical bonding to diffusion bonding, fundamentally altering how the metal terminal connects to the main body. This parameter change in the bonding process enables the joint to withstand high-temperature environments without significant strength loss.
2Device complexity
If the metal terminal has a simple L-shape structure for diffusion bonding, then the bonding process is simplified, but external stress concentrates on the portion between the bonding portion and mounting portion causing detachment
Solution Approach 1:
The patent segments the base of the metal terminal by providing cut-out portions that divide the base structure. This segmentation creates multiple stress distribution zones and prevents stress concentration at any single point, thereby improving resistance to detachment while maintaining structural integrity.
Solution Approach 2:
The patent adds dimensional complexity to the metal terminal base by introducing cut-out portions and ribs. These features add structural elements in multiple dimensions, creating a more complex geometry that effectively distributes stress throughout the structure rather than allowing concentration at critical points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents metal terminal detachment by distributing external stress and maintaining mechanical strength, ensuring a strong bond between the metal terminal and the ceramic electronic component even under high-temperature conditions.
Implementation Method 1
The metal terminal is connected to the external electrode of the electronic-component main body by diffusion bonding
Data Source
AI summary
A ceramic electronic component includes two electronic-component main bodies and two metal terminals. Each of the metal terminals includes a base, ribs on left and right sides of the base, and a mounting portion below the base. The base includes two bonding portions to be bonded to respective external electrodes of the two electronic-component main bodies and cut-out portions each having a closed shape and being disposed below the respective bonding portions. The ribs are bent from the left and right sides of the base in the width direction toward the electronic-component main body. The ribs extend from the top of the base in the height direction to the vicinity of the mounting-side major surface of the mounting-side electronic-component main body and do not reach the mounting portion. The mounting portion is bent from the bottom of the base toward the electronic-component main body.