Chamber Component Polishing for Deposit Removal Without Roughness Damage
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Solution Overview
Problem
Existing methods for removing deposits from chamber components in semiconductor manufacturing processes often damage the surface, increase roughness, or fail to completely remove deposits, leading to increased particle contamination and reduced chamber component lifespan.
Innovation Solution
A method involving the use of a pH-balanced slurry with nanoparticles for polishing, or a combination of water spraying, alcohol and acetone wiping, followed by heat treatment, to effectively remove deposits without damaging the chamber component surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods are used to remove deposits from chamber components, then deposits are removed, but the surface is damaged and roughness increases
Solution Approach 1:
The patent applies chemical mechanical polishing with carefully controlled parameters including slurry pH (7-9), particle size (0.01-10 micrometers), and polishing pressure to achieve deposit removal while maintaining surface roughness within 10% of original values, resolving the contradiction between effective cleaning and surface integrity
Solution Approach 2:
The patent uses composite slurries containing both chemical agents (ammonium hydroxide, hydrogen peroxide, deionized water) and mechanical abrasives (ceramic or diamond particles) to simultaneously achieve chemical dissolution of deposits and mechanical polishing of the surface, thereby removing deposits while maintaining surface finish
2Reliability
If chamber components are replaced frequently to maintain performance, then particle contamination is reduced, but operational costs and environmental impact increase
Solution Approach 1:
Instead of discarding chamber components after deposit accumulation, the patent recovers them through a systematic cleaning process involving chemical mechanical polishing and ultrasonic cleaning, restoring surface quality to within 10% of original roughness and extending component service life, thereby reducing waste and operational costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The methods maintain the surface roughness and functionality of chamber components, significantly extending their lifespan and reducing the need for replacement, thereby lowering operational costs and environmental impact.
Implementation Method 1
polishing the surface of the chamber component using a polish pad and the slurry
Implementation Method 2
polishing the surface of the chamber component using a polish pad and the slurry to remove deposits
Implementation Method 3
heating the chamber component to a temperature of about 500° C. to about 1500° C., wherein the metal fluoride deposits are removed from the surface of the chamber component as a result of the heating
Implementation Method 4
spraying a surface of the chamber component using water. After spraying the spraying the surface of the chamber component with water, the surface of the chamber component may be wiped using a combination of alcohol and acetone
Data Source
AI summary
Described herein is a method for removing deposits off a surface of a chamber component. The method includes receiving a chamber component, and fixing the chamber component in a fixture. A slurry is then applied to a surface of the chamber component, where the slurry has a pH of about 5 to about 9. The surface is then polished using a polish pad and the slurry. The surface roughness of the surface after polishing is within about 10% of the surface roughness before polishing, and wherein deposits on the surface of the chamber component are removed by polishing. An alternative method for removing deposits is also presented, wherein the chamber component is heated to a temperature of about 500° C. to about 1500° C.