Lapping Machines TRIZ Cases
- Optical Film-Thickness Monitoring for Wafer Polishing Abnormalities
Classified reflected-light spectra flag film-thickness measurement abnormalities during wafer polishing, helping prevent incorrect polishing.
- CMP Fluid Nozzle Motion Paths for Uniform Pad Polishing
Moving the CMP fluid nozzle along selected paths prevents slurry buildup on the pad and maintains uniform polishing across the substrate.
- Polishing Pad Conditioning with Adjustable Pressing Force Feedback
Adjustable stopper and sensor feedback control conditioning force to keep CMP polishing pads uniform, reduce wear, and protect substrate yield.
- Polishing Liquid Supply Head Alignment for Uniform Pad Coverage
Maintaining radial port alignment as the supply head moves across the pad improves slurry coverage uniformity and helps reduce substrate defects.
- Multi-Head Substrate Processing with Electromagnetic Pad Pressing
Multiple small processing pads and electromagnetic pressing speed substrate finishing while maintaining uniform film thickness.
- CMP Polishing Pad Thermal Conduction Through Deep-Groove Subpad
Deep polishing-layer grooves and a conductive subpad improve heat transfer in CMP, stabilizing pad temperature and removal rates.
- Reflected-Light Spectrum Inspection for Wafer Polishing Anomalies
Mapped reflected-light spectra flag abnormal film-thickness readings during wafer polishing, helping stop over-polishing and wafer damage.
- Silicon Wafer Polishing Sequence to Prevent LPDs and Scratches
A two-stage silicon wafer polishing sequence uses low- then high-density slurry to remove residues and prevent LPDs and micro scratches.
- CMP Pressure Chamber Control for Film Thickness Uniformity
Multiple pressure chambers and a corrected response model tailor CMP recipes to wafer thickness variation and improve film uniformity.
- CMP Interface Temperature Control for Stable Ceria Slurry Removal
Interface heating or cooling guided by ceria particle charge keeps CMP removal rate on target while limiting pad wear and consumable cost.
- CMP Pad Conditioner With Pneumatic Pressure Sensing
An airtight chamber and embedded pressure sensor enable real-time CMP conditioning pressure detection, reducing pad damage and wafer yield loss.
- Grinding and Polishing Recall Controls for Faster Parameter Setup
Quick-recall inputs store and restore platen speed, specimen speed, load, and cycle time to cut grinding and polishing setup time.
- CMP Pad Dressing With Nanobubble Rinse for Debris Removal
High-pressure rinse fluid with ultrasonic nanobubbles clears debris from CMP pads during dressing, helping prevent wafer scratches and yield loss.
- Optical Slurry Distribution Monitoring on CMP Polishing Pads
Optical sensing maps slurry distribution on the polishing pad, enabling feedback control of pressure and liquid supply for more uniform CMP.
- Substrate Cleaning Module With Two-Tank Ultrasonic Transfer
A two-tank horizontal transfer scheme improves substrate residue removal, avoids re-adhesion, and keeps the cleaning module structure simple.
- Spiral Pure Water Piping for Swinging Polishing Heads
A spiral pure water line around the swing axis absorbs twisting, preventing blockage and damage while keeping bearing cooling and lubrication stable.
- Annular Polishing Pad Control for Wafer Edge Precision
Segmented annular pad regions enable targeted maintenance and finer wafer edge polishing control, reducing defects and improving yield.