CMP Fluid Nozzle Motion Paths for Uniform Pad Polishing
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Solution Overview
Problem
The accumulation of substances in the polishing fluid on the polishing pad during extended use of a chemical mechanical polishing apparatus hinders uniform polishing.
Innovation Solution
A polishing apparatus with a polishing fluid supply device that includes a nozzle, driver, and connector, controlled by a controller to select from multiple operation modes with different moving paths, ensuring uniform distribution of polishing fluid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If polishing fluid is supplied continuously during extended polishing operation, then polishing process can be maintained, but uneven accumulation of substances in polishing fluid on polishing pad occurs hindering uniform polishing
Solution Approach 1:
The polishing fluid supply device is made movable instead of fixed, allowing it to change position dynamically during polishing operation. The device moves along a predetermined path that ensures uniform distribution of polishing fluid across the polishing pad surface, preventing localized accumulation and maintaining polishing uniformity during extended operation.
Solution Approach 2:
The system pre-establishes multiple predetermined moving paths for the polishing fluid supply device based on different polishing conditions. The controller selects the appropriate path in advance based on detected polishing state, enabling proactive adjustment before uneven accumulation significantly degrades polishing quality.
2Device complexity
If polishing fluid supply location is fixed, then device structure is simple, but uneven accumulation of polishing fluid occurs on polishing pad
Solution Approach 1:
The polishing fluid supply device incorporates a moving mechanism that allows the nozzle to traverse along predetermined paths. This dynamic positioning capability, controlled by a controller that selects from multiple pre-programmed paths, enables uniform fluid distribution without requiring a mechanically complex multi-nozzle system.
Solution Approach 2:
A single polishing fluid supply device is designed to perform multiple functions by executing different predetermined moving paths. The same device can adapt to various polishing conditions (different substrates, polishing stages, or pad conditions) by selecting from its library of pre-programmed paths, eliminating the need for multiple specialized fluid supply locations.
Data Source
AI summary
A polishing method performed by a polishing apparatus, includes: checking polishing conditions; selecting a first operation mode from among a plurality of operation modes based on polishing conditions; and performing polishing in the selected first operation mode.