Substrate Cleaning Module With Two-Tank Ultrasonic Transfer
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Solution Overview
Problem
Existing substrate cleaning methods, such as injecting cleaning liquid onto both surfaces of a substrate being transferred by a roller conveyor, fail to sufficiently remove residue like slurry, and immersing the substrate in a cleaning tank with a vertical posture can lead to re-adhesion of residue and complicate the apparatus structure.
Innovation Solution
A cleaning module with a transfer machine that transfers substrates between a grip or release position and a cleaning tank, using a guide roller to stabilize substrate positioning and a second transfer mechanism to ensure thorough cleaning without vertical immersion, combined with ultrasonic cleaning and scrub cleaning mechanisms to enhance cleaning capability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a guide roller is disposed to guide the substrate in the transfer machine, then the substrate can be stably housed in the housing space, but a left-uncleaned part is generated in the portion with which the guide roller is brought into contact
Solution Approach 1:
The cleaning tank is divided into a first cleaning tank and a second cleaning tank, with the substrate being cleaned in both tanks. The guide roller is disposed in the first cleaning tank, and the substrate is transferred to the second cleaning tank for additional cleaning, ensuring that the portion contacted by the guide roller is also cleaned in the second tank.
Solution Approach 2:
The substrate cleaning process transitions from a single-tank vertical immersion to a two-tank horizontal transfer system. The substrate is cleaned in the first tank, transferred horizontally to the second tank, and cleaned again, adding a spatial dimension to the cleaning process and ensuring complete coverage.
2Manufacturing precision
If the substrate is immersed in a cleaning tank with vertical posture for ultrasonic cleaning, then cleaning capability is improved, but the apparatus structure becomes complicated and residue may sink downward and re-adhere
Solution Approach 1:
The cleaning process is segmented into two horizontal cleaning tanks instead of one vertical ultrasonic tank. This divides the cleaning function into sequential stages, reducing the complexity of any single tank while maintaining effective cleaning capability.
Solution Approach 2:
Instead of using vertical immersion with ultrasonic waves, the patent employs horizontal transfer cleaning. The substrate is moved horizontally between tanks, and cleaning is performed through this horizontal motion, inverting the conventional vertical cleaning approach.
3Device complexity
If cleaning liquid is injected onto both surfaces of the substrate being transferred, then the cleaning process is simple, but residue such as slurry is not sufficiently removed
Solution Approach 1:
The transfer machine acts as an intermediary between the polishing process and the cleaning tanks. It provides a controlled environment where the substrate can be thoroughly cleaned in horizontal tanks before being transferred to the final drying area, ensuring complete residue removal.
Solution Approach 2:
The substrate undergoes preliminary cleaning in the first cleaning tank before being transferred to the second cleaning tank for additional cleaning. This preliminary action removes the bulk of the residue, and the second tank completes the cleaning process, ensuring thorough removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides stable substrate guidance, reduces residue re-adhesion, and improves cleaning efficiency with a simple structure, ensuring thorough removal of residue from both surfaces without complicating the apparatus design.
Implementation Method 1
a transfer machine for transferring the substrate between the grip or release position and the cleaning tank
Implementation Method 2
a guide roller that is brought into contact with an upper surface of the substrate transferred to the grip or release position to guide the substrate
Implementation Method 3
The cleaning tank is for cleaning a substrate with the surface to be polished facing downward
Implementation Method 4
it is also likely that it sinks downward in the cleaning liquid and re-adheres to a lower portion of the substrate
Data Source
AI summary
To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure.A cleaning module includes a first transfer mechanism 210-1, an ultrasonic cleaning tank 440, a transfer machine 420, and a second transfer mechanism 210-2. The first transfer mechanism 210-1 is for transferring a substrate WF with a surface to be polished facing downward up to a substrate grip or release position 418 on a downstream side along a transfer passage 405. The ultrasonic cleaning tank 440 is disposed at a position spaced apart from the transfer passage 405 and is for cleaning a substrate WF with the surface to be polished facing downward. The transfer machine 420 is for transferring the substrate WF between the substrate grip or release position 418 of the transfer passage 405 and the ultrasonic cleaning tank 440. The second transfer mechanism 210-2 is for transferring the substrate WF transferred to the substrate grip or release position 418 from the ultrasonic cleaning tank 440 by the transfer machine 420 to further downstream along the transfer passage 405.