Polishing Liquid Supply Head Alignment for Uniform Pad Coverage
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Solution Overview
Problem
Existing polishing liquid supply devices suffer from non-uniformity in the polishing liquid supply range and the occurrence of defects on substrates due to polishing liquid bouncing and adhering to arms, which affects the uniformity and efficiency of the polishing process.
Innovation Solution
A polishing apparatus with a polishing liquid supply device that includes a link mechanism and drive mechanism to maintain the arrangement of polishing liquid supply ports along the radial direction of the polishing pad, and an atomizer mechanism to prevent polishing liquid from adhering to the arm and falling onto the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the polishing liquid supply head is moved to an outer edge side of the polishing pad by turning the arm, then the polishing liquid can be supplied to a larger area of the polishing pad, but the arrangement direction of the polishing liquid supply ports shifts from radial to circumferential direction, causing the polishing liquid supply range to narrow and uniformity to deteriorate
Solution Approach 1:
The polishing liquid supply head is designed to dynamically change its orientation angle according to its position on the polishing pad. When the supply head is at the center, the ports are arranged radially; when moved to the outer edge, the ports rotate to maintain radial arrangement relative to the pad center. This dynamic adjustment ensures uniform polishing liquid distribution across the entire polishing area.
Solution Approach 2:
The orientation angle of the polishing liquid supply ports is changed as a variable parameter based on the position of the supply head. By adjusting the angle parameter dynamically, the system maintains optimal radial alignment of the supply ports with respect to the polishing pad center, ensuring consistent supply range and uniformity regardless of the supply head's radial position.
2Productivity
If the polishing liquid supply head is positioned close to the polishing pad surface, then the polishing liquid can be supplied efficiently, but the polishing liquid bounces from the polishing pad and adheres to the arm, causing defects on the substrate
Solution Approach 1:
An atomizer mechanism is introduced as an intermediary component between the polishing liquid supply head and the polishing pad. The atomizer disperses the polishing liquid into fine droplets before they reach the pad surface, preventing large droplets from bouncing off and adhering to the arm. This intermediary mechanism maintains efficient polishing while eliminating the harmful adhesion effect.
Solution Approach 2:
The conventional direct liquid supply mechanism is replaced with an atomization-based delivery system. Instead of supplying polishing liquid as a continuous stream or large droplets that can bounce and adhere, the system uses atomized spray to deliver the liquid, fundamentally changing the mechanical interaction between the liquid and the arm-polishing pad interface.
Data Source
AI summary
When a polishing liquid is supplied while moving a polishing liquid supply head including a plurality of polishing liquid supply ports above a polishing pad, a uniformity of a polishing liquid supply range is improved. A polishing apparatus 1 includes a polishing table for supporting a polishing pad 100, a polishing head 30 for holding an object, and a polishing liquid supply device 40 for supplying a polishing liquid between the polishing pad 100 and the object. The polishing liquid supply device 40 includes a polishing liquid supply head 41 including a plurality of polishing liquid supply ports 414, a link mechanism 60 configured to move the polishing liquid supply head 41 along a polishing surface of the polishing pad 100, and a drive mechanism 90 configured to drive the link mechanism 60. The drive mechanism 90 is configured to drive the link mechanism 60 such that the plurality of polishing liquid supply ports 414 are arranged along a radial direction of the polishing pad 100 in a first state 450 where the polishing liquid supply head 41 is disposed to be opposed to a center side of the polishing pad 100 and the plurality of polishing liquid supply ports 414 are arranged along a radial direction of the polishing pad 100 in a second state 460 where the polishing liquid supply head 41 is disposed to be opposed to an outer edge side of the polishing pad 100 compared with the first state 450.